Electronics Forum | Mon Mar 24 10:38:33 EDT 2008 | davef
No standard, but common practice is: IPC-TM-650 Test Methods Manual * Method 2.1.1, Microsectioning, Manual Method * Method 2.1.1.2, Microsectioning, Semi or Automatic Technique
Electronics Forum | Tue Mar 25 08:13:10 EDT 2008 | davef
Turns out, SMTnet didn't want us to use the name of the town where the publisher of Reference 1 is located.
Electronics Forum | Mon Mar 24 09:09:40 EDT 2008 | jdumont
Hello all, we have been seeing a lot of issues with broken or open vias on a couple of our bare boards. We have two vendors make these for us and the issue is only with one vendors boards. We have stopped using them until we can figure out what is go
Electronics Forum | Mon Mar 24 12:11:11 EDT 2008 | jdumont
Thats the one I found while researching this AM also. Thanks for the assist. Any ideas if this can be process related? Im sure it can be but its odd that it only happens on one vendors board. I think because it is an 10 layer board that maybe they ha
Electronics Forum | Mon Mar 24 22:53:22 EDT 2008 | davef
As you say, just about defect can be tied to process, one way or another. If you want to think about it, search the fine SMTnet Archives for background on barrel cracking. Other things are: * How thick is the actual via plating from the two supplier
Electronics Forum | Tue Mar 25 07:33:46 EDT 2008 | davef
References [Analog Devices] 1) "Surface Preparation and Microscopy of Materials" B Bousfield, John Wiley & Sons, LTD., West Susse_, England, 1992 2) "Metallography Principles and Procedures" Leco, Corp. 1992 3) "Buehler Dialog, Microstructural Analys
Electronics Forum | Thu Sep 20 15:05:20 EDT 2007 | jax
You can specify the prepreg thickness in the stackup. Once you have specified it somewhere, make your PCB manufacturer build to it... and prove it through cross-section analysis. Depending on the Board cost, we require a cross-section and analysis d
Electronics Forum | Mon Apr 28 15:20:50 EDT 2014 | davef
Your customer is correct. Your supplier has clamped some sort of machine to your butt and has plugged it in the wall outlet. Honest mistake: * IPC-A-600H, 3.3.2 Lifted Lands - (Cross Sections) ... pertains to boards that were cross sectioned after t
Electronics Forum | Mon Apr 27 19:31:12 EDT 2009 | stevek
Remember that the 25% is a reduction in cross sectional area. A void in the middle of the ball that reduces the cross sectional area by 25% is about half the diameter of the ball. If it is closer to either termination, the corresponding size would
Electronics Forum | Wed Apr 30 08:00:33 EDT 2003 | pjc
Jason, In Transmission AXI the entire solder joint volume is imaged, not just a slice (no missing information) as with Cross-Section. Also, there is no signal loss from mechanical or digital image reconstruction (highest contrast and edge strength).