Electronics Forum | Fri Apr 30 11:18:23 EDT 2004 | Bryan She
These days I've met much CSP fails.it's .5mm pitch,5x5mm outline CSP.we must reball it and mount it again on the boards because these Parts are very expensive and we can't scrape it off.is there anyone has any precieus experience or suggestions?or wh
Electronics Forum | Wed Apr 23 21:34:24 EDT 2008 | fowlerchang
It is CSP reliability issue, which is the mobile CPU from Spreadtrum. All the tests passed and shipped to customer. They assembly them and tested but failed. After they reflow this CSP with hot air gun, some of the boards passed. We got some board
Electronics Forum | Thu Jun 15 05:08:52 EDT 2000 | Frank
Hi, all, does anyone know what mechanical test regime is used to qualify underfills for CSP use.
Electronics Forum | Fri Apr 14 15:46:17 EDT 2000 | Madan Mohan
I work on CSP Rework Process Development. Can anyone suggest a way by which the component top temperature during removal / replacement can be reduced for the same solder joint temperatures (for example providing metal shields over component top in t
Electronics Forum | Sat Aug 21 07:10:34 EDT 1999 | K. Vikas Sharma
Want to know the Tools/ Process required to get started with CSP prototyping and R & D. Anyone working on this , please help out.
Electronics Forum | Mon Sep 14 11:29:11 EDT 1998 | Anderson Dutra
Reading some technical report I found the term "CSP", but no explanation. I guess something about Chip Scale Package... but not sure. Could someone please explain it to me? Rgds, Anderson
Electronics Forum | Fri Sep 18 22:04:23 EDT 1998 | David J.
Steve: Excellent description of CSP's. I think the term "Micro BGA" has been trademarked by Amkor.
Electronics Forum | Thu Nov 15 01:05:02 EST 2001 | jamstart
I think for x-ray, it really depend what package you are looking at. For CSP, it should be at least min 90KV, min 5 micro focus size. CSP definitely need a higher mag and resolution.
Electronics Forum | Mon Mar 04 22:50:03 EST 2002 | Nell
Hi, Could anyone tell me where can I get the 0.4mm pitch CSP Dummy Component and the Test PCB? Any comments will be appreaciated. Thanks and Regards. Nell
Electronics Forum | Wed Oct 23 09:41:49 EDT 2002 | Antonio
Can anyone give me a ran down process on CSP? Is it like BGA process that needs reflow? what oven do I need...vapor, nitrogen or convection? is under fill a necessity? when and why do i have to under fill? when not to underfill and why? etc.... than
