Electronics Forum | Mon May 21 20:45:01 EDT 2018 | jacobidiego
Honestly, I wonder the same. Is it Age the only variable to this? I can not reduce ageing.
Electronics Forum | Thu May 24 06:27:09 EDT 2018 | cyber_wolf
Bottom line....if you have an SPI machine, that's the judge and jury.
Electronics Forum | Mon Jun 18 16:48:00 EDT 2001 | Gil Zweig
We have found a significant number of PBGA problems associated with physical deformation of the package. Deformations such as dishing (potatoe chipping) and delamination under the die (popcorning). These can be detected by x-ray by the variation patt
Electronics Forum | Thu Oct 26 14:43:09 EDT 2006 | Billabong
We are having difficulty with thermal deformation of these AMP surface mount connectors. It is a RoHS compliant part, but only rated to withstand 245c for 10-30 seconds. Even at this temperature, we are seeing PLASTIC deforming which prevents mating
Electronics Forum | Mon Jan 26 22:43:45 EST 2009 | davef
Questions are: * Can you use the part fabricator's specification of lead coplanairity as the basis for accepting this build? * Beyond the issue of acceptable deformation of the leads, how do you know that whatever you did to bend the two outer leads
Electronics Forum | Wed Oct 09 16:15:18 EDT 2019 | cbart
when you say Kapton sheets assume you mean flex boards? are you using pallets to process them? Do you think the issue is the parts are being dropped above these deformations? how does the board print? are you getting good solder deposits from screen
Electronics Forum | Wed Jun 02 11:29:39 EDT 1999 | John O'Brien
| | I am currently sourcing equipment to mount CSP devices. I have looked at the GSM Flexjet & also the Siemens 80 F series. However these machines only look for ball presence not ball deformation. Panasonic are the only ones who have a 3-D camera ca
Electronics Forum | Wed Jun 16 04:14:11 EDT 2004 | loz
I have used this method as well, it did have its drawbacks though. We used to have the positioning holes etched into the stencils and this worked fine, for a while. After a couple of months of opening up and closing the fingers on the hanging rack, w
Electronics Forum | Thu Jul 29 09:00:56 EDT 2004 | Bryan Sherh
Some short happens between the balls of CPU socket in my site.we decrease the reflow time from about 90sec to 50 sec and decreased the fail rate of short.but x-ray shows balls from part of the Ball array deformed....we can't further decrease the time
Electronics Forum | Mon Jan 26 10:15:51 EST 2009 | john123
Can anyone help me determine the acceptability level for lead deformation (see attachment). The outer two leads on the left side were bent during the pick and place centering operation. I've looked in the IPC-A-610 book and could only find informa
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