Industry News: deposit verification (Page 2 of 5)

DEK Wins Big in Las Vegas, Earns Three Industry Awards

Industry News | 2008-04-09 14:30:19.0

For electronics industry specialists who want the most advanced and cost-effective materials deposition technologies available, DEK is a sure bet. Over the three days at APEX in Las Vegas last week, DEK�s leadership position was again confirmed as the mass imaging front runner earned three top industry honors.

ASM Assembly Systems (DEK)

Viscom to Exhibit 3-D SPI Unit with SPI-AOI Uplink at the IPC APEX Expo

Industry News | 2012-01-19 23:09:10.0

Viscom proudly announces that it will exhibit its recently introduced 3-D SPI system in Booth #2629 at the upcoming IPC APEX Expo. The system is now available with the unique SPI-AOI Uplink feature that provides better defect detection during post-reflow AOI, ensuring the lowest false alarm rates.

Viscom AG

Speedprint to Highlight the SP710 and Added Features at the SMTA Rocky Mountain Expo

Industry News | 2015-01-05 20:09:12.0

Speedprint Technology will highlight the SP710 Screen Printer at the SMTA Rocky Mountain Expo & Tech Forum, scheduled to take place Wednesday, January 28, 2015 at the West Club at Mile High Stadium in Denver, CO. Speedprint representatives will discuss the benefits of the SP710, Advanced Dispense Unit +, Velocity Plus and SPI communication system.

Speedprint Technology

Discover Low-Maintenance Screen Printing from Speedprint at the IPC APEX EXPO

Industry News | 2015-01-20 17:45:54.0

Speedprint Technology will showcase the award-winning SP710 Screen Printer in Booth #2833 at the IPC APEX EXPO, scheduled to take place Feb. 24-26, 2015 at the San Diego Convention Center in California. Speedprint prides the SP710 for low ownership costs, flexibility, ease of maintenance and overall value.

Speedprint Technology

DEK Safeguards Productivity with Sentinel Launch at Productronica

Industry News | 2009-11-24 22:09:36.0

Screen printing and mass imaging world leader DEK chose Productronica earlier this month to launch Sentinel, a breakthrough productivity-enhancing solution that lowers the cost of achieving more good boards from the stencil printing process.

ASM Assembly Systems (DEK)

DEK lends its support to Blundell Technology Week & Mini Exhibition 2010

Industry News | 2010-09-13 14:50:29.0

DEK will be the resident screen printing technology expert at the forthcoming Blundell Technology Week & Mini Exhibition 2010. Taking place at Blundell Production Equipment in Coventry from 12th – 14th October, the event will unite leading industry experts, innovative technology demonstrations and informative discussions.

ASM Assembly Systems (DEK)

DEK Gives APEX Attendees Look at Future-Proofed Technologies

Industry News | 2009-03-17 04:47:26.0

From DEK booth #2412 at this year's APEX event, being held over March 31 � April 2 in Las Vegas, Nevada, visitors will witness the ultimate in product versatility and choice for a truly future-proofed investment and productivity advantage.

ASM Assembly Systems (DEK)

DEK’s ProFlow® ATx system meets real-world mass production & product complexity challenges

Industry News | 2010-04-28 21:43:42.0

Following a successful evaluation period, DEK’s ProFlow® ATx enclosed print head technology has been adopted by a high profile electronics company due to its ability to meet complex mass production requirements. As specialists in design, production and product management, the electronics solutions company had strict evaluation criteria that the DEK system successfully met and even, in some cases, exceeded.

ASM Assembly Systems (DEK)

Discover DEK technologies in action at National Electronics Week, Stand A10

Industry News | 2008-05-23 18:33:56.0

The DEK team is preparing to take its manufacturing solution to the inaugural National Electronics Week (NEW), being held at London�s Earls Court 2 over June 17th � 19th. In addition to showcasing powerful print platforms, Productivity Tools, precision screens, stencils and consumables on Stand A10, the mass imaging leader will also be demonstrating key technologies at the show�s Production Live! environment.

ASM Assembly Systems (DEK)

New Tacky Flux Technology from Henkel Advances POP Processes and has Cameras Seeing Blue

Industry News | 2009-07-28 12:23:26.0

In a breakthrough for emerging package-on-package (POP) device processes, Henkel has developed Multicore® TFN700B™, a new no-clean, halide-free tacky flux material formulated specifically for today’s challenging POP applications.

ASM Assembly Systems (DEK)


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