The Forte™ Series delivers exceptional dispensing productivity and accuracy for high-volume consumer electronics manufacturing, printed circuit board assembly, flexible circuit, MEMs, and electromechanical assembly applications. Next-generation and
The 3rd-generation M3 multi-function chip mounter implements high speed, stability and accuracy operation. The system meets the high-density, miniaturization, multi-encapsulation, large capacity, high precision characteristics requirement of LED fiel
The Vortik® family of progressive cavity pumps (PCP) are fully integrated with our industry-leading dispensing systems and software to deliver repeatable volumetric accuracy without interruption. Benefits Improved productivity – continu
New Equipment | Coating Equipment
ASCEN LED conformal coating machine can apply several types of coatings to Light Emitting Diodes (LED’s), including parylene. Conformal coating electronic encapsulation processes offer superb protection for your products and will leng
Zymet's underfill encapsulants for flip chips are designed to enhance the thermal cycle performance. They incorporate silica filler, used to reduce the encapsulant’s CTE, that are highly engineered in both morphology and particle size distribution to
For encapsulation of wirebonded IC’s Zymet's glob top and dam-and-fill encapsulants are UV curable, yet they have properties similar to conventional heat cured encapsulants, high Tg’s and low CTE’s. With UV cure, curing is performed quickly, inline
A self-priming, encapsulant silicone RTV. A convenient 1:1 mix ration 2-part RTV which features: neutral cure, fast R.T. deep section cure, adhesion to plastics for primerless adhesive encapsulation.
New Equipment | Assembly Services
Surface mount assembly (SMT) Thru hole device (THD) Surface mount plus Thru hole (SMT+THD) Lead and Lead free construction Cable construction Conformal Coating Potting Epoxy / Resin encapsulation 3D Encapsulation Testing
Lite Fast 2081, a UV encapsulant, was specifically developed to relieve the stress placed on toroidal coils or electronic components that will experience pressure during the molding process. With a durometer Shore D hardness of 5, the UV encapsulant
