Electronics Forum | Wed May 16 14:18:52 EDT 2001 | davef
Cal please help me understand your point better. How does the assembly determine the torque requirements? Are you saying that you expect the assembly drawing to contain a torque specification? If not, how do you determine the torque from the assem
Electronics Forum | Thu Jun 21 22:32:13 EDT 2001 | davef
Dang Brian, you didn't fix it so great after all!!! This ended-up on the Production Forum, [Er, did I select the wrong forum in the excitment of the moment? Naw!!!!].
Electronics Forum | Mon Jul 23 20:51:54 EDT 2001 | davef
We are optimizing our process, it's just that we build to a daily or semi-daily demand schedule of product quantities of 50 er so.
Electronics Forum | Wed Aug 01 20:21:34 EDT 2001 | davef
0.4 W/m�C [er sumpin like thet]. But it's real brittle. Sofer rework, ya can just pop that sucker [component to be replaced] right arf.
Electronics Forum | Thu Jan 13 13:49:32 EST 2000 | Dave F
JAX: Thanks bud, I've been known to hurt myself walking across a flat floor. Hell, I hurt myself in bed one time, er wazat someone hurt me in bed on time??? Can't remember. Dave
Electronics Forum | Sun Aug 19 09:27:09 EDT 2001 | davef
Yano, imalookinat two vendor specification sheets that say your paste should sit around at "print temperature" for 1 to 6 hours before printing [er, words to that effect]. Werejallgit this 6 hours stuff from?
Electronics Forum | Wed Apr 10 22:32:44 EDT 2002 | davef
This is free material. The total cost of the reel, er whatever, was included in the completed production run. Obvious choices are: * Throw it in the dumpster * Return it in stock at zero inventory cost and save it 'til the next time you run that pr
Electronics Forum | Fri May 17 16:53:50 EDT 2002 | davef
I recall a couple of papers in the SMTA 'Knowledgebase' that used ball shearing and an element in a study that compared BGA [maybe uBGA] component fabrication methods, er sumpin.
Electronics Forum | Fri Aug 16 10:10:49 EDT 2002 | davef
I think there are guidelines for baking in J-STD-033. Contact Francois Monette, Cogiscan Inc., 450-534-2644, fmonette@cogiscan.com With the 125�C for 12 hours, er whatever, bake you are trying to strike a balance between: * Removing the moisture f
Electronics Forum | Fri Sep 27 11:20:21 EDT 2002 | davef
Mar, The previous post makes the best point. Your finish spec depends on the COB process you plan to use. Is your process: * Gold wire bond * Aluminum wire bond * Flip chip * Er, watt
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