New Equipment | Solder Materials
With a composition of 62% Tin / 36% Lead / 2% Silver, Kapp Electric Eutectic is a cost effective eutectic electrical/electronic solder where Lead is permissible. Silver increases the strength and vibration resistance of the joint in higher stress app
BGA component types, characteristics, eutectic and non-eutectic solder, ceramics, determination of profiles, equipment, BGA removal, site preparation, reballing, soldering , cleaning etc.
Industry Directory | Consultant / Service Provider / Manufacturer
Microtek focuses on optimum microelectronics packaging solutions from prototype to production for applications in: Die Attach, Die Sorting, Flip Chip, MEMS, MOEMS, VCSEL, Photonics, Ultrasonic, RFID..
Double Pump for a quick and powerful suction and easy clean up. Designed For SMT and Thru-hole Desoldering of Eutectic or Lead Free Solders.
SIPAD Systems Incorporated (SSi) is the Exclusive Supplier of SIPAD solid solder deposit in North America and the only SIPAD Solid Solder Deposit (SSD) coating service bureau in the world. SIPAD Systems Inc. supplies SIPAD solid solder coating servi
Technical Library | 2013-10-17 17:46:01.0
Although several commercial and experimental Pb-free solder alloys are available as replacements for Sn-Pb solders, the following families of solders are of particular interest and are the prevailing choices of industry: eutectic Sn-Ag, eutectic Sn-Cu, eutectic Sn-Zn, eutectic Bi-Sn, and Sn–In. Since the properties of the binary Pb-free solders cannot fully meet the requirements for applications in electronic packaging, additional alloying elements are added to improve the performance of these alloys. Thus, ternary and even quaternary Pb-free solders have been developed, such as Sn-Ag-Cu, Sn-Ag-Bi, and Sn-Zn-Bi solder...
Career Center | , British Columbia Canada | Engineering
Looking for an engineer or technician to do some contract work on the assembly, testing, and failure of analysis of microelectronics packagages. The individual needs to understand the process of gold wire bonding and eutectic die attachment. Knowle
Three solutions for virtually any application. BGA Socket Adapter Systems featuring eutectic solder balls and footprints which match BGA device are designed for high volume production applications. Pop-Top� Socket Adapter Systems features integral he
We do reballing services for BGA reballing as follow: (1) Eutectic-ball BGA (2) Gigh-temp-ball CBGA (3) Lead-Free-ball BGA. We offer reliable, quick-turn services in as little as 24 hours.
SIPAD Systems Incorporated (SSi) is the Exclusive Supplier of SIPAD solid solder deposit in North America and the only SIPAD Solid Solder Deposit (SSD) coating service bureau in the world. SIPAD Systems Inc. supplies SIPAD solid solder coating servi
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