Electronics Forum | Sun Sep 08 22:38:23 EDT 2019 | sssamw
what's your final verified ok stencil thickness for the QFN and BGA?
Electronics Forum | Tue Feb 11 13:12:25 EST 2003 | Jim Mills
Use a PCB fab house that is capable of "Conductive Via Filling" is the way to do it right. A conductive epoxy is used to fill the drilled via PRIOR to final plating. After final plating, the surface of the "Filled Via" will appear to be the same as t
Electronics Forum | Wed Oct 15 12:38:56 EDT 2003 | mrulien
We have CM's that manufacture products and have established global FPY goals (across all products). My question is, how can I determine if the established goals are appropriate to meet my final quality expecations (at the customer)? Are there indus
Electronics Forum | Sun Dec 02 00:17:35 EST 2007 | jmelson
I finally figured it out - in my manual it shows as a "63:Overflow" and says it has run out of memory for management information. I finally realized they were talking about the MIS statistical data of feeders, heads and mounting programs. I cleared
Electronics Forum | Tue Jan 29 09:41:52 EST 2008 | d0min0
Hello, we use DataPAQ 6 slots - but after tech guys finally killed their profiler on wave its theirs now last year we used SolderStar neptune, 3-9 slots, but it is too easy to destroy it (4 times in repair...) so finally I started to use SlimKIC 2
Electronics Forum | Thu Mar 11 18:04:20 EST 2010 | dcell_1t
Currently we measure only in schedule attainment... based on Final Assembly requirements, how many boards were produced during the week. We're working on link Final assembly requirements to be able to produce "leaner" in smaller batches, but is a pai
Electronics Forum | Wed Sep 01 05:29:40 EDT 2010 | arjan
We baked the parts just before assembly. 2>we baked the parts and store them in 4 days in drycab (60degC, Rh0,5%)and finally assembly 3> we baked the parts and refowed them on a leadfree profile and finally the assembly on the boards. The same we als
Electronics Forum | Thu Aug 03 12:44:07 EDT 2017 | davef
Try: * RD Chemical [ http://rdchem.com/chemposit-sn-rd-51.html ] * MacDermid [ http://electronics.macdermidenthone.com/products-and-applications/printed-circuit-board/final-finishes/immersion-tin/ ] * Technic [ https://www.technic.com/applications
Electronics Forum | Mon Jan 22 15:01:32 EST 2001 | aiscorp
CIM systems for electronics assembly have traditionally considered the PCB only. Final assembly "modules" are often attached to traditional systems to accommodate this common requirement for pre-PCB assembly, mechanical assembly, and final assembly
Electronics Forum | Tue Feb 02 12:31:26 EST 1999 | John
| I have a product using high temperature solder to connect terminal pins to a PCB. The board is single sided copper, no plaiting. The solder is 95% tin 5 % silver. The flux is low activity rosin. The product is a subassembly. When the product i
winsouce.jpg)
.gif)
