Full Site - : fuji and qp351e-mm and fine and pitch (Page 2 of 3)

BGA's and the Fuji IP2

Electronics Forum | Mon Jul 15 17:35:42 EDT 2002 | davef

Micro BGA � (�BGA�). A Tessera brand name for a fine [0.5 mm and 0.75 mm solder ball] pitch BGA.

Fuji Pick and Place Machines

Electronics Forum | Fri May 07 02:27:57 EDT 2004 | Grant Petty

Hi, They do what we need component wise, however I was wondering if anyone had info on reliability, ease of programming. We are looking XP 142 and 242 series chip shooters and fine pitch placers. Regards, Grant Blackmagic Design

tape splicing pros and cons

Electronics Forum | Wed Sep 21 12:30:03 EDT 2005 | Rob

Hi Greg, We've used lots of machines over the years & seen lots of different tape related issues - the main one being snap off of the cover tape, usually due to too much glue, over entusiastic heat seal, or a feeder requiring maintainance. Also the

Fuji CP6 and IP3 specifications request

Electronics Forum | Thu Aug 04 13:58:20 EDT 2016 | sumote

Does anyone have the technical specifications for the Fuji CP6 and the Fuji IP3? Looking for the placement speed (parts per hour), accuracy, smallest/largest component size, fine-pitch (what size it can do). Our new sales guy is putting together some

Re: Epoxy printing and wave soldering on 0603 and 0402 components

Electronics Forum | Tue Jul 13 14:19:00 EDT 1999 | JohnW

| | | Hi, | | | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) | | | | | | Sec

Re: Epoxy printing and wave soldering on 0603 and 0402 components

Electronics Forum | Tue Jul 13 14:25:57 EDT 1999 | Earl Moon

| | | | Hi, | | | | | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) | | | | |

Re: Epoxy printing and wave soldering on 0603 and 0402 components

Electronics Forum | Wed Jul 14 21:34:16 EDT 1999 | karlin

| | | | | Hi, | | | | | | | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) | |

Re: Epoxy printing and wave soldering on 0603 and 0402 components

Electronics Forum | Thu Jul 15 14:38:38 EDT 1999 | JohnW

| | | | | | Hi, | | | | | | | | | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants)


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