Full Site - : gold plated components - solderability issue (Page 2 of 62)

IPC Conference to “Clean Up” Reliability Problems

Industry News | 2013-10-28 16:31:54.0

IPC Conference on Solder and Reliability: Materials, Processes and Tests, November 13–14 in Costa Mesa, Calif.

Association Connecting Electronics Industries (IPC)

IPC APEX EXPO™ Highlights the Most Exciting Eleven New Products in the Show’s Innovative Technology Center

Industry News | 2011-03-28 13:24:06.0

Eleven products have been selected for inclusion in the Innovative Technology Center at IPC APEX EXPO™, April 12–14, 2011, in Las Vegas, according to show organizer IPC – Association Connecting Electronics Industries. Assessed by a review board of industry experts, the products were selected based on their representation of a new or emerging technology of significant value and relevance to the electronics manufacturing industry.

Association Connecting Electronics Industries (IPC)

IPC, SOLDERTEC Conference to Address Hot Lead Free Topics

Industry News | 2003-03-03 08:48:54.0

The International Conference on Lead-Free Electronics on June 10-13, 2003, in Brussels, Belgium.

Association Connecting Electronics Industries (IPC)

IPC, SOLDERTEC Conference to Address Hot Lead Free Topics

Industry News | 2003-04-10 10:06:38.0

International Conference on Lead-Free Electronics on June 10-13, 2003, in Brussels, Belgium

Association Connecting Electronics Industries (IPC)

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Industry News | 2018-12-08 03:29:29.0

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Flason Electronic Co.,limited

The Future of Embedded Passive Components

Industry News | 2018-10-18 10:28:01.0

The Future of Embedded Passive Components

Flason Electronic Co.,limited

wave soldering has become the future direction of development

Industry News | 2018-10-18 09:33:23.0

wave soldering has become the future direction of development

Flason Electronic Co.,limited

How to Prevent Solder Ball and Bridging Defects during the SMT Reflow Process

Industry News | 2018-10-18 08:32:52.0

How to Prevent Solder Ball and Bridging Defects during the SMT Reflow Process

Flason Electronic Co.,limited

IPC Delivers New Standard on Handling, Packaging and Storage of Printed Boards

Industry News | 2010-09-13 15:36:15.0

IPC — Association Connecting Electronics Industries® has released IPC-1601, Printed Board Handling and Storage Guidelines. The industry's sole standard on the handling, packaging and storage of printed boards, IPC-1601 provides users with guidance on how to protect printed boards from contamination, physical damage, solderability degradation, electrostatic discharge and moisture uptake.

Association Connecting Electronics Industries (IPC)

Volunteers Honored for Contributions to Electronics Industry and IPC More than 80 Awards Presented at IPC Midwest

Industry News | 2012-08-22 15:57:01.0

IPC – Association Connecting Electronics Industries® presented Special Recognition, Distinguished Committee Leadership and Committee Service Awards at IPC Midwest Conference & Exhibition

Association Connecting Electronics Industries (IPC)


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