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UV Curing Machine UVC-502 Series

UV Curing Machine UVC-502 Series

New Equipment | Curing Equipment

UV Curing machine UVC-502 series is equipped with 2 groups of quality metal halid lamps which is suitable for conformal coating material curing. 

1 CLICK SMT TECHNOLOGY CO., Limited

MULTICORE Solder Pastes

MULTICORE Solder Pastes

New Equipment | Solder Materials

As the world's leading developer of advanced solder paste materials, Henkel delivers decades of technology and expertise for optimized process performance. With ground breaking new formulations to provide an easy transition to lead-free as well as pr

Henkel Electronic Materials

MULTICORE Solder Fluxes

MULTICORE Solder Fluxes

New Equipment | Solder Materials

With a variety of formulations for various wave soldering processes, MULTICORE brand high performance liquid flux technology is compatible with dual-wave and lead-free processes, delivering outstanding results. From no-clean to low-residue to VOC-f

Henkel Electronic Materials

UV Curing Machine UVC-602

UV Curing Machine UVC-602

New Equipment | Curing Equipment

Provide UV Curing With In Line Coating System. UV Curing machine UVC-602 adopts 2 groups of quality imported metal halide tubes with long service life , pin chain , rail conveying system and SMEMA connector makes machine easy to connect with inline

1 CLICK SMT TECHNOLOGY CO., Limited

Aoki Laboratories Ltd. [Solder Products Supplier]

Industry Directory | Manufacturer

Aoki Laboratories Ltd. is an ISO-9002 certified company specializes in manufacturing of Sn/Pb Bar Solder, Cored Wire and Paste.Environmental friendly products, such as: lead-free solder, no-clean non-halide solder flux, no-clean cored wire and Non-CFC cleaner, are compliance with ISO-14001 requirements.

OAJ Cored Wire

OAJ Cored Wire

New Equipment | Solder Materials

OAJ Cored Wire features a halide-activated system that has been neutralized with an amine. The aminehydrohalide provides a high activation level that produces excellent tarnish or oxide removal, and maximum capillary action, leading to faster wetting

AIM Solder

WS Water Washable Tacky/Rework Paste Flux

WS Water Washable Tacky/Rework Paste Flux

New Equipment | Solder Materials

AIM WS Paste Flux is a water washable tacky/rework flux designed to wet virtually all solderable electronic surfaces, components, assemblies, and substrates. AIM WS Paste Flux may be used for general touch up or rework of printed circuit boards, and

AIM Solder

NC676 - No Clean Solder Paste

NC676 - No Clean Solder Paste

New Equipment | Solder Materials

NC676 No Clean Solder Paste is a new generation halide-free, rosin-based chemistry designed to provide a previously unseen level of repeatability and consistency to the printing process. This paste offers an excellent open time, extended abandon time

FCT ASSEMBLY, INC.

UV Curing Machine UV-502

UV Curing Machine UV-502

New Equipment | Curing Equipment

UV Curing machine UVC-502 series is equipped with 2 groups of quality metal halid lamps which is suitable for conformal coatng material curing.  1.  UV system adopt 2 groups of metal halid lamps ,each lamp is controlled independently, lamp height is

1 CLICK SMT TECHNOLOGY CO., Limited

Whisker Formation Induced by Component and Assembly Ionic Contamination

Technical Library | 2023-02-13 18:56:42.0

This paper describes the results of an intensive whisker formation study on Pb-free assemblies with different levels of cleanliness. Thirteen types of as-received surface-mount and pin-through-hole components were cleaned and intentionally contaminated with solutions containing chloride, sulfate, bromide, and nitrate. Then the parts were assembled on double-sided boards that were also cleaned or intentionally contaminated with three fluxes having different halide contents. The assemblies were subjected to high-temperature/high-humidity testing (85_C/85% RH). Periodic examination found that contamination triggered whisker formation on both exposed tin and solder fillets. Whisker occurrence and parameters depending on the type and level of contamination are discussed. Cross-sections were used to assess the metallurgical aspects of whisker formation and the microstructural changes occurring during corrosion.

Celestica Corporation


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