Industry News | 2011-02-14 14:35:18.0
Christopher Associates/Koki Solder announces that Jasbir Bath, Consulting Engineer, will give a presentation about Head-in-Pillow Component Soldering Defects at the upcoming LA/O.C. SMTA Chapter Dinner, scheduled to take place Thursday, February 17, 2011 at JT Schmid’s Restaurant & Brewery in Anaheim, CA at 7 p.m.
Industry News | 2010-01-11 14:37:46.0
January 2010 ? Christopher Associates, a pioneering supplier to the electronics manufacturing industry, announces that Jasbir Bath, Consulting Engineer with Christopher Associates/Koki Solder, will host a SMTA-sponsored Webinar titled “Reducing Head-in-Pillow with Tin/Lead and Lead-Free Solder Paste Development.” The Webinar will be held on Thursday, February 4, 2010 at 11 a.m. USA Eastern/8 a.m. USA Pacific time, and will run for approximately 60-90 minutes with a question and answer period.
Industry News | 2009-05-01 01:10:48.0
ITASCA, IL � April 2009 � Kester announces that its FL250D no-clean solder paste has been added to the global approved materials list of a leading network equipment company due to its excellent properties in terms of eliminating/preventing head-in-pillow defects.
Industry News | 2014-05-13 17:01:55.0
Indium Corporation's Graham Wilson, applications engineer, will present at Brasage in Brest, France on Friday, May 23. Wilson's presentation, Elimination of Head-in-Pillow in PoP Assembly: A Flux Approach, discusses eliminating head-in-pillow defects in the package-on-package (PoP) assembly process by engineering unique attributes of the flux chemistries of dipping fluxes and pastes.
Industry News | 2022-04-13 09:47:35.0
MacDermid Alpha Electronics Solutions will be participating in the upcoming Global SMT & Packaging panel discussion, "Head-in-Pillow - what causes it, how do you spot it and how do you avoid it?" on April 19 at 10:30 am New York / 3:30 pm London.
Industry News | 2010-11-02 10:42:48.0
Christopher Associates today announced the US introduction of Koki’s S3X48-M500 and S3X48-M500C Printable No-Clean Lead-Free Solder Pastes. Originally designed and formulated for superior head-in-pillow performance, the pastes also exhibit exceptional wetting and printing.
Industry News | 2012-06-01 09:09:55.0
Head-in-Pillow (HiP) soldering defects are common with modern SMT component placement. As a result, Practical Components has introduced the PBGA 928-HiP, a component that is designed specifically to be susceptible to HiP defects. It features a large 4x4 body size, 928 balls and a single small die that has a propensity toward the ball-in-socket HiP soldering defect.
Industry News | 2014-04-30 13:42:31.0
Indium Corporation's Indium10.1 Solder Paste is a Pb-free halogen-containing solder paste with the lowest levels of voiding for QFNs, BGAs, and pads with large ground planes.
Industry News | 2011-04-07 11:22:40.0
Indium8.9 Series solder pastes offer Pb-free and halogen-free solutions that eliminate graping and head-in-pillow defects.
Industry News | 2012-02-16 18:04:11.0
Indium8.9 Solder Paste offers Pb-free and halogen-free solutions that eliminate graping and head-in-pillow defects.
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