New Equipment | Board Handling - Storage
Solder paste printing range (1) SMT technology of resistance, capacitance, inductance, diode, triode and other chip components production and processing: 01005, 0201, 04020603, 0805, 1206 and other specifications and sizes; (2) , IC: support SOP, T
New Equipment | Assembly Services
Product features: The servo system is convenient and accurate for positioning. The Japanese THK guide rail and Taiwan STK variable frequency motor are used to drive the scraper base to ensure the printing accuracy. The printing scraper can be rota
technical parameter Model: s1200 (special type for LED light bar) Overall dimension (L × w × h): 1650 × 620 × 1550 (mm) Platform size: 320 × 1300 (mm) PCB size: 250 × 1250 (mm) Applicable template size: 550 ×
New Equipment | Assembly Services
G9 + automatic vision printing machine is a new product for SMT high-end application field, which can perfectly meet the process requirements of 03015, 0.25pich and other fine spacing, high precision and high speed. Introduction to standard function
Parts & Supplies | Pick and Place/Feeders
We also supply following Siemens Spare parts : 00375895-01 STOP STRIP RIGHT SIDE 2 00375987-01 STOP STRIP LEFT SIDE 2 00376006-01 Filter element f. air filter 00376038-01 CABLE: TREE SET POWER SUPPLY HS60 00376124S02 C-O-TABL
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Events Calendar | Tue Mar 26 00:00:00 EDT 2024 - Tue Mar 26 00:00:00 EDT 2024 | Taoyuan City,
SMTA Taiwan Tech Forum 2024
Parts & Supplies | Component Packaging
E3141729000 JUKI 2020 Z Slider Shaft IC Right Head SMT Nozzle Shaft Description: 1, Original Place: Japan 2, Part Name: Z Slider Shaft IC 3, Model: E3141729000 4, quality: New
Industry News | 2024-01-02 07:59:07.0
Explore the versatility of Automated IC Programming Systems, decoding a myriad of package types for precise and efficient electronics manufacturing.
Industry News | 2022-08-08 07:10:23.0
Registration is now open for the first IPC Advanced Packaging Symposium: Building the IC-Substrate and Package Assembly Ecosystem, to be held October 11-12, 2022, at the Kimpton Hotel Monaco in Washington, D.C. Focusing on the opportunities and challenges for next-generation advanced packaging production, the IPC Advanced Packaging Symposium offers in-depth discussions on strengthening the IC-substrate and package assembly ecosystem across North America and Europe.
