Industry News | 2013-01-04 15:59:09.0
04 Jan 2013 Heller Industries Shanghai will be celebrating its 10th year of operation on Jan 31, 2013.
Technical Library | 2023-01-17 17:50:59.0
Heller's new Condenser Tube Flux Recovery System is designed to provide more efficient flux collection than earlier Heller flux collection systems; while providing minimal down time for inspection and cleaning. The entire system easily fits within the rear of the top shell of an 1800-EXL oven. The system utilizes a different set of top shell caps specially designed to provide the best serviceability of both the flux collection system and maintenance of the heater zone blower motors.
Industry News | 2013-01-04 16:00:38.0
04 Jan 2013 Heller Industries will showcase the Mark5 Series - SMT Reflow Soldering Ovens February 19-21 in San Diego, CA USA at the IPC APEX EXPO.
Industry News | 2013-09-10 17:48:54.0
We are happy to announce that we have opened a new Class 10K cleanroom in the NJ facility.
Industry News | 2014-04-11 12:49:57.0
Heller Industries was announced the winner of the Circuits Assembly 2014 Service Excellence Award in the category of Reflow Soldering Companies.
Industry News | 2018-07-02 07:23:51.0
Heller Industries Announces That It Will NOT Be Subject To The 25% Import Duty on Reflow Oven Purchases
Industry News | 2021-04-14 10:42:33.0
The 2021 Service Excellence Award for Soldering Equipment was given to Heller Industries. Circuits Assembly recognizes companies that receive the highest customer service ratings, as judged by their own customers.
Industry News | 2023-10-18 17:51:11.0
2023年10月11日，"Step-by-Step Excellence Awards一步步卓越奖"（SbSEA, 原Vision Awards远见奖）颁奖仪式在深圳NEPCON Asia展会隆重举办。本次获奖产品是由电子制造行业知名专家组成的评委会, 和一批经甄选的《一步步新技术》忠实读者，从本届众多的参加评选的新产品中, 评选出对于电子制造行业有显著贡献的产品。
Technical Library | 2019-07-10 23:36:14.0
Pockets of gas, or voids, trapped in the solder interface between discrete power management devices and circuit assemblies are, unfortunately, excellent insulators, or barriers to thermal conductivity. This resistance to heat flow reduces the electrical efficiency of these devices, reducing battery life and expected functional life time of electronic assemblies. There is also a corresponding increase in current density (as the area for current conduction is reduced) that generates additional heat, further leading to performance degradation.
Technical Library | 2023-01-17 17:22:28.0
The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.
