Electronics Forum | Wed Jun 26 21:56:24 EDT 2002 | ianchan
Hi mate, there is another thread ongoing about such an BGA vs oven length issue, suggest posting your question there. As for that someone's opinion, he/she is entitled to it. Then again how did that someone determine this level of "insufficient"?
Electronics Forum | Mon Feb 21 08:33:53 EST 2000 | Tony Di Mauro
Kurt, When I was working in a captive manufacturing house we had been to migrate toward tenting all vias under the BGA to eliminate not only shorts but insufficient (Starved) joints. Tony
Electronics Forum | Mon Feb 21 08:33:53 EST 2000 | Tony Di Mauro
Kurt, When I was working in a captive manufacturing house we had been to migrate toward tenting all vias under the BGA to eliminate not only shorts but insufficient (Starved) joints. Tony
Electronics Forum | Thu Mar 22 16:06:22 EST 2001 | dblsixes
Our next plan of attack is to dog-bone the solder aperature. By reducing the width of the solder paste at the heel, we hope to slow the flow up the leg of the pin while the temperature of the pad catches up. We have boards that were HASL ...
Electronics Forum | Thu Mar 22 21:53:49 EST 2001 | davef
Don't mess with the doggie stuff until you get longer pads [and then you won't have to mess with it] because you'll just ruin your lead definition with more paste and still not have the heel fillet you desire.
Electronics Forum | Sat Mar 24 16:34:06 EST 2001 | Stefan
Can you increase the placement force on your P&P machine? It should squeeze the solder paste to all sides including the heel.
Electronics Forum | Mon Mar 26 11:20:39 EST 2001 | dblsixes
The pads are 0.070 x 0.012 ... as spec'ed, and as measured. The pad extends approximately 0.017 behind where the Class 3 fillet is required to be. (It used to be 0.037 on an older design that exhibited similar, but not as bad of heel fillets.)
Electronics Forum | Thu Sep 02 11:50:58 EDT 1999 | ScottM
| Could someone shares their experience on the causes of 'Open' in the BGA after reflow. | | Insufficient solderpaste. "No flux" (sat too long after print). Those are what I've experienced. Cheers, Scott
Electronics Forum | Mon Jul 29 18:51:47 EDT 2002 | davef
Consider: * Printing: errors [ie, insufficient, excess, skipping, etc.] paste doesn�t roll in front of squeegee, paste adheres to squeegee at the end of stroke, paste does not release. * Component placement: orientation, wrong component, missing comp
Electronics Forum | Sat Oct 12 05:40:05 EDT 2002 | Kenture
Hello All, I am having issued with insufficient solder due to via in pad. It is a 10 mils via and PCB is 70 mil thick. Six mils stencils was used since there are some 20 mils (No clean process). Any recommendation? Thank you.
