Industry News | 2003-06-16 08:33:59.0
This action is part of the DuPont strategy to build on its leadership position in circuit materials, by expanding and strengthening the level of service and support available to its customers.
Industry News | 2003-03-07 08:52:29.0
Announced the appointment of John Stumpf as chief financial officer
Industry News | 2003-03-24 09:38:49.0
Declared a regular quarterly dividend of $0.06 per share payable May 6, 2003 to stockholders of record at the close of business on April 8, 2003.
Industry News | 2003-04-09 08:25:50.0
A new design guide is available from Genalog detailing Samtec's flex circuit capabilities.
Industry News | 2003-06-25 12:49:17.0
Additional state of the art automated surface mount assembly equipment has been installed to provide expanded capacity for advanced technology printed circuit assemblies
Industry News | 2003-04-07 10:25:38.0
Customers Commend Teradyne's Assembly Test and Connection Systems Divisions
Industry News | 2003-05-28 08:28:54.0
For June 2-4 (Mon. - Wed.)Design Automation Conference 2003
Industry News | 2003-03-12 09:10:10.0
As part of the opening celebration, Teradyne will be exhibiting this week at SEMICON China and in April at Nepcon Shanghai.
Industry News | 2003-06-04 08:27:58.0
DuPont cites rising raw material, transportation and energy costs as reasons for the increase.
Industry News | 2003-06-24 08:14:51.0
R/flex� 3850 laminate is produced in a range of copper and LCP thicknesses, just as the single-clad laminate, and is available in standard panel formats.
