| https://www.eptac.com/webinars/ipc-7095c-the-definitive-source-for-everything-bga/
the electronic devices that make this all possible. The BGA. IPC-7095C “Design and Assembly Process Implementation for BGAs” is fast becoming the key source for dealing with the assembly of this interconnection technology into the products of today
| http://etasmt.com/te_news_bulletin/2021-08-31/23570.chtml
• Excessive pad size • Via in pad draining solder from interconnection Reflow-related causes: • Preheat too aggressive • Peak reflow (liquidus) temperature not being attained
| http://etasmt.com/cc?ID=te_news_bulletin,23575&url=_print
. Such growth can be as much as several microns during reflow. Therefore it is imperative that liquidus dwell time -the interval that the interconnection is above the melting temperature of the solder alloy, be kept as short as possible
| https://www.eptac.com/webinars/ipc-7095c-the-definitive-source-for-everything-bga
the electronic devices that make this all possible. The BGA. IPC-7095C “Design and Assembly Process Implementation for BGAs” is fast becoming the key source for dealing with the assembly of this interconnection technology into the products of today
| https://productronica.com/en/discover/trade-fair-topics/cables-coils-hybrids/
? The sector for cable manufacturing and coiled products has been a popular highlight at each productronica for a long time. Interconnection technology is also closely related to cable technology
| https://www.eptac.com/about-us/press-releases/press/eptac-corporations-leo-lambert-honored-for-industry-contributions-by-the-ipc
. His service provided leadership for IPC Technical Programs and accomplishments, which contributed materially to the advancement of the electronic interconnection industry
. The full color specification includes pictures of virtually every type of component interconnection in use today. It clearly describes the minimal acceptable conditions for each interconnection. The IPC-J-STD-001
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2020/02/Void-Reduction-Warpage-Vacuum-Reflow-Soldering.pdf
. Often it induces fatal interconnection defects and initiates a weak connection between the silicon die and substrate/wafer substrate and wafer package
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/Void-Reduction-Warpage-Vacuum-Reflow-Soldering.pdf
. Often it induces fatal interconnection defects and initiates a weak connection between the silicon die and substrate/wafer substrate and wafer package
Blackfox Training Institute, LLC | https://www.blackfox.com/wp-content/uploads/2017/04/BlackFox_Sharon.pdf
- dered interconnection and the corresponding lacing/restraining criteria associated with cable and harness assemblies. IPC/WHMA-A-620 Space Hardware Addendum The students will demonstrate the ability to build and install in a unit three complete ca- bles
