Electronics Forum | Wed May 09 11:05:26 EDT 2001 | davef
IPC-7525 "Stencil Design Guidelines" �9 END OF LIFE, states "Stencils should be inspected periodically for damage that would conribute to decreased printing performance. Refer to Section 7 for inspection guidelines." Or words to that effect. Now b
Electronics Forum | Thu Jun 23 10:06:10 EDT 2011 | davef
Leave it to the Eurolanders to come-up with a goofy, confusing name for something simple. Stepped stencils are chemical etched or laser cut. IPC-7525 provides guidelines on designing stepped stencils. Look here http://www.ipc.org/TOC/IPC-7525.pdf
Electronics Forum | Mon Oct 09 19:56:41 EDT 2000 | Dave F
CJ: Arturo and the others make good suggestions. Consider: IPC-7525 Stencil Design Guidelines
Electronics Forum | Tue Jan 16 21:00:11 EST 2001 | davef
Two good sources of information are: 1 IPC-7525 Stencil Design Guidelines 2 SMTnet fine Archives [once the guys get them back up and running after the conversion is complete]
Electronics Forum | Wed Jan 17 03:06:56 EST 2001 | George English
You can try : Optimum pad design and solder joint shape for reliability. written for the NPL(England) by Milos Dusek and Chis Hunt, (good ol' English names !!) or of course the IPC guidelines IPC-7525 Regards G
Electronics Forum | Fri Sep 21 10:56:38 EDT 2001 | davef
Not as such. Look at IPC-7525 �Stencil Design Guidelines� The issues are: area and aspect ratios. They relate the size of the aperture opening to the thickness of the stencil. Check the fine SMTnet Archives for guidelines.
Electronics Forum | Fri Jun 07 15:16:25 EDT 2002 | gdstanton
Ben, Get a copy of IPC 7525 and review it. This will help you understand the relationship of aperture geometry to paste transfer. Good Luck, Greg
Electronics Forum | Mon Dec 16 13:33:09 EST 2002 | pjc
square apertures provide better paste release than round in most applications. See IPC 7525 Stencil Design Guidelines
Electronics Forum | Fri Aug 21 09:36:50 EDT 2015 | esoderberg
Looking for better design information than is contained in IPC 7525A. Specifically the minimum trough width and length of the step to achieve the necessary paste reduction.
Electronics Forum | Tue Aug 09 10:46:43 EDT 2016 | emeto
this really depends on the pad sizes. You can see 15 different pad sizes for the same component package. Take a look in IPC 7525. I am attaching an article as well, so you can get an idea.
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