Electronics Forum | Tue Feb 02 10:56:53 EST 1999 | Justin Medernach
| Would anyone have experience or information on where I could find pad geometry for tantalum capacitors that can be surface or plated thru hole mounted. | Yup, Check out IPC-782. That's got all the info on land geometries that you'd be looking f
Electronics Forum | Tue Oct 29 15:25:12 EST 2002 | russ
Thanks for the info, I have previously not used the Ps and Qs so to speak and I am finding now that we are running into trouble mostly due to component height and body sizes. So for example we currently have "16 pin SOP" what we need is "16 pin SOP,
Electronics Forum | Fri Mar 17 16:39:33 EST 2000 | Larry
We have just installed an omega wave to our W/S machine and are tring to W/S some of our bottom side surface mount components. I am still getting skips on some sot 23's. The component lay out meets all IPC 782 guidelines. I have verified these setti
Electronics Forum | Mon Mar 20 18:15:05 EST 2000 | Russ
Larry, SOTs are a wonderful thing to try and wave solder! They are about as nice as Tant caps. I have found that shadowing is usually the biggest problem assuming that the other wave parameters are good, in your case it seems that they are. Couple
Electronics Forum | Mon Dec 13 09:43:28 EST 1999 | Chris May
As Wolfang says about slightly bent legs, handling is of the essence. Are these devices decanted into another tray for your machine. It may be worthwhile doing a "movement" chart for these components. Do not explain why or when you are doing it beca
Electronics Forum | Tue Jun 04 20:34:28 EDT 2002 | russ
Jason, Excessive thermal ramp rates, misprints, improper pad design, paste type, placement pressure, all can cause solderballs. Do the pads on this board meet IPC 782 criterias? I have found that too much pad underneath component can cause this. A
Electronics Forum | Fri Oct 18 17:47:37 EDT 2002 | russ
What is the determination of poor soldering fails pull test, non-wetting, visual)? I have never heard of an SMT component that has leads higher than the body of the component. Refer to IPC 782 3.6.1.7 it provide the guidelines for SMT standoff heig
Electronics Forum | Mon Jun 30 09:40:35 EDT 2003 | russ
I don't know of any web sites but Practical components has quite a few packages listed in their catalog, IPC 782 also has some of this information. But if you are looking for chip components the "1206" is the actual size this part is .12 L x .06 in
Electronics Forum | Wed Sep 06 11:18:52 EDT 2000 | Chris May
Randy, I have been with my present company about 14 months and my first and ongoing task is to improve 1st time yield rates at ATE. Upon examination of the failures (14 months ago)there were cases of IC legs being physically wider than the pads on
Electronics Forum | Mon Sep 21 08:14:14 EDT 1998 | Steve Gregory
| Hello: | I would like to know what causes tombstombing and how can it be prevented? | Thx. | Nichol Hi Nichol! A tombstone happens when solder doesn't wet equally on both terminations during reflow...now why that happens can be found by looking at
