24 k-tech electronic organiser results

EPTAC Corporation Collaborates with PowerAmerica to Deliver IPC Designer Certification - EPTAC - Tra

| https://www.eptac.com/press/eptac-corporation-collaborates-with-poweramerica-to-deliver-ipc-designer-certification/

-STD-001 Compliance Audit of Columbia Tech EPTAC Corporation Introduces New Interactive “Hands-On” PCB Inspection Program EPTAC Corporation’s Leo Lambert Honored for Industry Contributions by the IPC Categories Press Release Manchester, NH – June 7, 2016

Optimizing Reflowed Solder TIM (sTIMs) Processes for Emerging Heterogeneous Integrated Packages

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf

@indium.com 1228 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) 2377-5726/22/$31.00 ©2022 IEEE DOI 10.1109/ECTC51906.2022.00197 Fig 2: Mean Heat Flux by Wafer Fab Node

Heller Industries Inc.

SMTA Certified Engineers

Surface Mount Technology Association (SMTA) | https://www.smta.org/certification/certified_engineers.cfm

. Joseph Biggs, Dwayne Bigler, Sechan Electronics, Inc. Bryan Blackburn, Aerotech, Inc. Jim Blundon, Whelen Engineering Company, Inc. Kevin Boblits, K & M Manufacturing Solutions Kurt Boeglin, Kimball Electronics Inc

Surface Mount Technology Association (SMTA)

Vacuum Fluxless Reflow Technology for Fine Pitch First Level Interconnect Bumping Applications

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Vacuum-Fluxless-Reflow-Technology-for-Fine-Pitch.pdf

”, 31st Annual Electronic Packaging Symposium and Semicon West 2019. [7] W. Lin, “The Void-free Reflow Soldering of BGA with Vacuum”, 2007 8th International Conference on Electronic Packaging Technology. [8] T. Ewald, N. Holle, K. Wolter, “Void Formation

Heller Industries Inc.

*Mehran Maalekian, Ph.D., Aranav Das, Ludo Krassenburg, Co van Veen, Ph.D., Alexander Kodentsov, Ph.D., Mo Biglari, Ph.D., Mat- Tech Seeking University Graduate Talent and Collaborators for Industrial Research Hosted by: *Martin Anselm, Ph.D

40731 | https://www.smta.org/smtai/SMTAI-2019-Technical-Program.pdf?v=200609010628

Surface Mount Technology Association (SMTA)

40731

*Mehran Maalekian, Ph.D., Aranav Das, Ludo Krassenburg, Co van Veen, Ph.D., Alexander Kodentsov, Ph.D., Mo Biglari, Ph.D., Mat- Tech Seeking University Graduate Talent and Collaborators for Industrial Research Hosted by: *Martin Anselm, Ph.D

40731 | https://www.smta.org/smtai/SMTAI-2019-Technical-Program.pdf?v=200622100619

Surface Mount Technology Association (SMTA)

40731

The Branford Group - Recent Auctions

| http://www.thebranfordgroup.com/dnn3/Auctions/RecentAuctions.aspx

IT Day 1 of 2 Stamford, CT TeraComm    [Online] SOLD - Auction Closed on 4/12/2023 Surplus Equipment from TeraComm’s Tier One Electronic Test and Measurement Customers Featuring TeleDyne Lecroy wavesurfer 6074 Oscilloscopes (New

The Branford Group - Recent Auctions

| http://www.thebranfordgroup.com/dnn3/Auctions/PastSales/tabid/58/Default.aspx

IT Day 1 of 2 Stamford, CT TeraComm    [Online] SOLD - Auction Closed on 4/12/2023 Surplus Equipment from TeraComm’s Tier One Electronic Test and Measurement Customers Featuring TeleDyne Lecroy wavesurfer 6074 Oscilloscopes (New

EU Privacy Notice

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/our-company/ethics-and-compliance/eu-privacy-policy

. tradeshow organiser  f) from our own affiliates g) from various subscription services; and/or h) publicly available sources (for example, search engines and social media sites).  (ii

ASYMTEK Products | Nordson Electronics Solutions

US0683966

GPD Global | https://www.gpd-global.com/co_website/pdf/GPD-Global-CMRT-2021.xlsx

., Ltd. 8. Gansu Seemine Material Hi-Tech Co Ltd 9. Guangdong Jinding Gold Limited 10. Hangzhou Fuchunjiang Smelting Co., Ltd. 11. Hunan Chenzhou Mining Industry Group 12. Kennecott Utah Copper LLC 13. Lingbao Jinyuan Tonghui Refinery Co. Ltd. 14. Luoyang

GPD Global