Electronics Forum | Fri Apr 21 07:44:04 EDT 2006 | amol_kane
yes! i though this thread looked familiar! looks like it has been repeated....even the response from muse is very very familiar...that, or i am have a serious attack of deja vu! thanks for the requote though.......by doing some research I decided to
Electronics Forum | Sun Mar 12 01:58:44 EST 2006 | grantp
Hi, We have been soldering lead free BGA's onto products with lead based paste, and we have had no increase in defects at all. We have used a standard lead paste profile, so we are not altering the temps anything from what's recommended by the paste
Electronics Forum | Tue Mar 07 12:06:56 EST 2006 | billyd
muse- I agree with you. You should never mix chemistries if you don't absolutely have to. If you HAVE to, you can go with a lead free BGA with leaded paste with much fewer defects than the other way around.
Electronics Forum | Mon Mar 13 10:45:44 EST 2006 | muse95
The original issue was Co. does not need to go Pbfree, but some BGA's they use are only available Pbfree. They don't want to throw away Pb BGA stock, so some boards might have a combination of both Pb and Pbfree BGAs. The question basically was Shou
Electronics Forum | Tue Mar 07 14:18:32 EST 2006 | James
Billy, I have to disagree with you. We inadvertently soldered a Pb BGA with SAC305 paste and then had it micro sectioned and spectrum analyzed. Imagine our surprise when we saw the spectrum analysis showed Pb. The micro sections showed none to ac
Electronics Forum | Tue Mar 07 10:46:24 EST 2006 | muse95
I have to disagree with you, BillyD. If Craig searches the forum, he will see that the concept of a Pbfree BGA with SnPb paste has been debated many times. You say it is fine. I say it is NOT. There have been several studies done that clearly sho
Electronics Forum | Tue Mar 07 20:48:59 EST 2006 | rbodmer
Craig. i spoke with a process engineer today and he told me that if you mix pb and non pb it may work but may cause premature failures if in a thermal cycleing environment. failure cause may be micro fractures.
Electronics Forum | Tue Mar 07 14:23:21 EST 2006 | billyd
I think it has a whole lot to do with the heat applied, and the paste type. It was a seriously populated, very thick board, so we had to go big with the heat just to make 240-ish. That produced voids maybe 45 or 50% of the ball size. We knew immediat
Electronics Forum | Sat Mar 11 15:05:54 EST 2006 | Kerm
Hi Craig: I agree with muse. The problems almost always will show up later on duringg life cycles in terms of reliability problems. While the solder joints may look acceptable right after production there is no guarantee of meeting the reliability r
Electronics Forum | Wed Jul 27 15:54:44 EDT 2005 | Hiram
Hi everybody, We have wave solder fixtures made of Durapol and multiple wave solder machines. Most likely we�ll use the same pallets for either tin-lead or lead-free solder for a while (of course after washing the pallets). Should we test the palle
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