Electronics Forum | Fri Mar 03 09:48:06 EST 2000 | Wolfgang Busko
I have heard about it. The main reason is to save money. The problem is, or better is said, that the mixing isn�t that simple for you got have a homogen paste afterwards and the solderballs shouldn�t be deformed in size so that problems during printi
Electronics Forum | Fri Feb 11 13:36:40 EST 2000 | Finepitch Services
Jeff, I guess my experience in such issues always took me back to the screen printing process and I only want to bring up that portion of the possible causes to this case. When we talk about coplanarity, the component lead coplanarity first comes t
Electronics Forum | Wed Nov 01 10:03:42 EST 2000 | Wolfgang Busko
Hi Adam, if your product needs the full width of your wave you won�t have any chance to adjust an angle. For smaller PCB�s you might consider having your carriers made in two pieces. One outer piece to match your transportionsystem and one inner cir
Electronics Forum | Tue Jul 25 12:14:12 EDT 2000 | Wolfgang Busko
Hi Vicky, seems to be always the same dilemma with CAD people. My experience is that they can provide data in all possible formats, sometimes using scripts they write to create whatever output is needed. It needs a little diplomacy and the exact for
Electronics Forum | Thu Apr 13 10:01:54 EDT 2000 | Wolfgang Busko
Hi: Use the whip on your operators.!!! Serious: The assembly should know how much time they have left to process those parts safely. Keep them as long as possible in the drybags, reclose the bags immediately after getting the needed parts out. In t
Electronics Forum | Fri Mar 10 09:01:44 EST 2000 | Wolfgang Busko
Hi John, we had one shot with silver coated PCBs. With "no clean" and no changes in process parameters ( we had no input on necessary changes from the boardhouse ) we encountered wetting problems in the first reflow soldering process. Later it was s
Electronics Forum | Thu Mar 09 05:44:07 EST 2000 | Wolfgang Busko
Hi Edmund, J-STD-013 "IMPLEMENTATION of BALL GRID ARRAY and other HIGH DENSITY TECHNOLOGY" should be a great help for you. Component manufacturers ( try Motorola via Internet) also give good advice. For the DFM aspects get in contact with your asse
Electronics Forum | Thu Mar 09 04:02:12 EST 2000 | Wolfgang Busko
We used an air knife using foam fluxer and no clean flux to remove excessive flux from the boards for a better look afterwards. A secondary effect might be that the flux is forced into the vias giving you better results on the top. If you feel a need
Electronics Forum | Fri Mar 03 09:48:06 EST 2000 | Wolfgang Busko
I have heard about it. The main reason is to save money. The problem is, or better is said, that the mixing isn�t that simple for you got have a homogen paste afterwards and the solderballs shouldn�t be deformed in size so that problems during printi
Electronics Forum | Mon Jul 02 06:01:22 EDT 2001 | wbu
Well, I�ve never encountered any problems with it. If you use paste in the specified window according time and environment there should be no problem. If you try to measure this force you would IMO check out if you yourself did not treat the paste as
