Electronics Forum | Tue Aug 17 10:26:26 EDT 2010 | quest@fr
Our customer ask us how many repair (component removal, change and soldering) we guaranty for SMT components on our printed wiring board. We all have the number "3" in mind but we can't justify it by a standard. We can't reply "state of the art". Doe
Electronics Forum | Mon Oct 28 07:07:39 EST 2002 | cyber_wolf
It has been my experience that when all conditions are as they are supposed to be there should be zero or very little deflection. When you start placing components with pick and place equipment that does not have a Z pressure sense, you run the possi
Electronics Forum | Wed Oct 30 01:23:22 EST 2002 | jasper
It has been my experience that when all > conditions are as they are supposed to be there > should be zero or very little deflection. When > you start placing components with pick and place > equipment that does not have a Z pressure sense, > yo
Electronics Forum | Sat Jan 20 20:54:03 EST 2001 | fmonette
Dear Mike, As you might have noticed from the labels on the dry bags, the maximum floor life is specified by the component manufacturer and it can range from 1 year (level 2) down to a few hours after mandatory bake (level 6). This limit is based o
Electronics Forum | Tue Jan 23 09:03:00 EST 2001 | fmonette
This guideline is actually in the IPC/JEDEC standard J-STD-033, May 1999 (although it is not spelled out very clearly, thus the current confusion in the industry). The technical reason is that moisture diffusion is a very slow process. Once parts ha
Electronics Forum | Sun Jun 23 02:16:47 EDT 2019 | emanuel
Some manufacturers put very strong glue, the wider the part is so increases the glue strength. May sound funny but the only thing that worked was attaching a fishing weight to the tape, need to play a little until you find the correct size. The only
Electronics Forum | Wed Feb 09 09:54:50 EST 2000 | JAX
Trying to place PTH components with an SMT machine is possible but maybe not plausible. Would you have to buy specialized tools and equipment for the job ( gripper nozzles ). Are the machines you have capable. i.e.. Would you need camera modification
Electronics Forum | Tue Nov 25 05:20:20 EST 2014 | grimus
Could be. I am making overprint to achieve proper amount of solder paste inside hole. Now I am trying to reduce maximum overprint and compensate it with step - up stencil. This could reduce effect that some particles of solder paste are not gathering
Electronics Forum | Tue Sep 04 11:26:12 EDT 2001 | Jean Michel
During the solderin of a double side board, how can I calculate the maximum weight of a component I can put in the first side to avoid the component fall down in the oven (depending on the soler join surface) ? Are there some rules ?
Electronics Forum | Fri Oct 08 20:23:23 EDT 1999 | Bix
Can anyone tell me the formula/method to determine the amount of weight that solder's surface tension can support. (ie: Maximum weight of components soldered onto a bottom side of a board during a top side reflow on a Paste/Paste process). Thanks, S
