Industry News | 2009-09-17 15:06:04.0
OSAKA, JAPAN — September 2009 — Nihon Superior Co. Ltd., an advanced soldering and brazing supplier to the worldwide market, announces that it will showcase a new, expanded range of SN100C products in booth 624 at the upcoming SMTA International, scheduled to take place October 6-7, 2009 at The Town and Country Resort and Convention Center in San Diego, CA.
Industry News | 2009-11-02 21:58:24.0
OSAKA, JAPAN — November 2009 — Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global electronics industry announces that it will display a full range of products based on its unique lead-free solder SN100C in its booth at the SMTA Southeast Asia Technical Conference on Electronics Assembly Technologies at the Equatorial Hotel in Penang, Malaysia, November 18-20, 2009.
Industry News | 2011-09-01 21:35:02.0
Nihon Superior (Singapore) Pte. Ltd., subsidiary of Nihon Superior Co. Ltd. will showcase a new, expanded range of SN100C products in booth 1060 at the upcoming Productronica India 2011 exhibition
Industry News | 2012-01-24 15:15:34.0
Nihon Superior (Singapore) Pte. Ltd. will showcase a new, expanded range of SN100C products in booth B-74B at the upcoming Electronics For You Expo 2012 , scheduled to take place February 16-18, 2012 in Hall No. 11 B, at the Pragati Maidan in New Delhi, India.
Electronics Forum | Fri Oct 20 10:15:13 EDT 2006 | wrongway
mid chip solder balls we had that trouble for awhile we went from a 8 mil thick stencil to 6 mil stencil and did some home plate style of cut outs in the stencil for the 1206 caps and resistors it seemed to fix our mid chip solder balls
Electronics Forum | Tue Jul 15 15:46:05 EDT 2008 | slthomas
Can you describe your solder balls...mid-chip solder balls, "splatter" around pads, etc.?
Electronics Forum | Fri Jan 14 16:21:42 EST 2000 | Dave Chapman
We are having mid chip solder balls on chips and resistors. Seeing the problem on 80% of the assemblies we run. Anywhere from 1 to six of the balls per board. We have slowed the oven down, increased the pressure on the screenprinter to get less paste
Electronics Forum | Thu Jul 19 08:00:03 EDT 2001 | doctord
Solder balls or mid chip beads? Remember IPC classification for Class 2 allows mid chip beads encapsulated in flux. Usually on R's and C's first thing I would do is verify .006 laser stencil 10% reduction and the most critical, The paste must be on t
Electronics Forum | Fri Jan 21 10:40:15 EST 2000 | Dave Chapman
Having adjusted the profile speed slower and adjusting the temps to the recommended lower levels, amazingly the mid chips have almost disapeared (90%). It appears they have been trying to run a "1 profile fits all" on the ovens for Alpha 737 and UP78
Electronics Forum | Wed Jul 25 11:55:21 EDT 2007 | ck_the_flip
Zoinks!! Doing the homeplate design on 0402 will actually make your tombstones WORSE! Think about it. Your wetting forces are now on the ENDS of the device with no solder paste toward the middle of the device to tack the part down - a gauranteed f
