Industry News | 2013-04-03 18:46:12.0
IPC – Association Connecting Electronics Industries® invites researchers, academics, technical experts and industry leaders to submit abstracts for the 2014 IPC APEX EXPO® at the Mandalay Bay Resort and Convention Center in Las Vegas.
Industry News | 2019-09-10 13:25:11.0
IPC — Association Connecting Electronics Industries® invites researchers, technical experts and industry leaders to submit abstracts for poster presentations at IPC APEX EXPO®, the industry’s premier conference and exhibition for printed board design and manufacturing, electronics assembly and test. Poster presentations are scheduled for Wednesday, February 5, 2020, and will be displayed throughout the event, offering additional visibility.
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PCBA V-cut machine F886 automatic v-groove pcb cutting machine Features ▶HMI touch screen control, simple operation, training can be mastered and used. ▶PLC+ servo motor control, stable and reliable performance, higher repeatability. ▶The width of t
Used SMT Equipment | X-Ray Inspection
Phoenix Microme|x 160 kV 160 kV proprietary sub-micron X-ray source (open design) with “unlimited” lifetime, including a demountable collimator for enhanced image quality X-ray protection cabinet, including laser-crosshair positioning aid
MLF leadless CSP with daisy chain for solder practice and temperature profiling.
Industry Directory | Consultant / Service Provider / Manufacturer / Manufacturer's Representative
Dummy Components and IC Assembly/IC Packaging Service Provider
Technical Library | 2023-08-04 15:38:36.0
The MicroLeadFrame® (MLF®)/Quad Flat No-Lead (QFN) packaging solution is extremely popular in the semiconductor industry. It is used in applications ranging from consumer electronics and communications to those requiring high reliability performance, such as the automotive industry. The wide acceptance of this packaging design is primarily due to its flexible form factors, size, scalability and thermal dissipation capabilities. The adaptation and acceptance of MLF/QFN packages in automotive high reliability applications has led to the development of materials and processes that have extended its capabilities to meet the performance and quality requirements. One of process developments that is enabling the success of the MLF/QFN within the automotive industry has been the innovation of side wettable flanks that provide the capability to inspect the package lead to printed circuit board (PCB) interfaces for reliable solder joints. Traditionally, through-board X-ray was the accepted method for detecting reliable solder joints for leadless packages. However, as PBC layer counts and routing complexities have increased, this method to detect well-formed solder fillets has proven ineffective and incapable of meeting the inspection requirements. To support increased reliability and more accurate inspection of the leadless package solder joints, processes to form side-wettable flanks have been developed. These processes enable the formation of solder fillets that are detectable using state-of-the-art automated optical inspection (AOI) equipment, providing increased throughput for the surface mount technology (SMT) processes and improved quality as well.
New Equipment | Industrial Automation
2MLQ-TR8B 2MLQ-TR8B ZhongHaiDe (Fujian) Industrial Equipment Co., Ltd., which is a well-developed equipment supplier in the field of automation in China currently. Our company has been established for 4 years, located in a rapidly developing coasta
