Industry News | 2003-01-29 13:23:31.0
A Common Drain Configuration that is 80% Smaller than Devices in the TSSOP-8 Package
Industry News | 2009-01-13 19:55:39.0
OXFORD, CT � January 2009 � MIRTEC Corp., the AOI market leader in North America, reports strong growth in sales revenue for its North American Sales and Service Division.
Industry News | 2010-01-21 15:16:41.0
NASHUA, NH, USA -- Microscan Technologies, Inc. (NASDAQ:PWAV), the Global Technology Leader in Precision Data Acquisition and Control Solutions, showcased the expansion of its worldwide operations with the grand opening of its newest R & D manufacturing facility located in Nashua, NH USA.. The ribbon cutting ceremony took place on 14th January 2010 gathering a select group of key customers and media representatives.
Industry News | 2003-06-10 08:56:19.0
Seeing the increasing number of electronic products having image capturing functions in the market, the Company has decided to seek to further augment its manufacturing capabilities to produce image sensors to satisfy order demand for these components.
Industry News | 2019-10-16 14:45:19.0
MIRTEC announces that the company will premier its all-new ALPHA 3D Automated Optical Inspection System at productronica 2019. New to this event, Messe München and Konradin Verlag have organized a 3D AOI Arena in Hall A2. Leading 3D AOI manufacturers such as MIRTEC will demonstrate their latest 3D Inspection Technology at this four-day event scheduled to take place Nov. 12-15, 2019, at the Munich Trade Fair Center in Munich, Germany.
Industry News | 2003-05-02 08:58:57.0
Bob Ferguson has been appointed PWB General Manager, North America.
Industry News | 2015-05-07 19:28:29.0
MIRTEC announce a new strategic cooperation that will empower yield improvement in the electronics manufacturing industry.
Industry News | 2007-01-29 15:10:05.0
Palo Alto, Calif.
Industry News | 2015-06-11 16:02:18.0
MIRTEC, "The Global Leader in Inspection Technology," will exhibit its most recent solutions for System in Package (SiP) inspection and measurement at SEMICON WEST 2015; July 14-16, 2015, at the Moscone Center in San Francisco, CA. Visitors are invited to booth # 2343 for a detailed demonstration of this exciting new technology.
Industry News | 2003-04-15 08:57:18.0
First Implementation of the Package Platform Delivers 50-percent Cost, 60-percent Height, and 75-percent Area Reductions over Conventional RF Module Technologies
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