Electronics Forum | Wed Dec 29 14:30:28 EST 1999 | Dan Woodward
I am not sure if I have seen an article comparing solder joint strength Vs pressfit although I am sure this has been researched by literally hundreds of companies before they felt comfortable going to pressfit. I know one of the issues with solder is
Electronics Forum | Mon Sep 03 08:56:26 EDT 2001 | henriksn
Hi everyone, I work in a development firm, that has a small prototype department. We have recently invested in a small automatic SMD pick&place machine. When mounting over 100 different components, the machine runs out of feedercapacity, and the res
Electronics Forum | Tue Sep 18 10:43:59 EDT 2001 | henriksn
Hi, And thanks for the advice. I have tried your method now, and it seems to be working. By visual inspection with a microscope it was almost impossible to tell the differrence between the pcb that had been in the frig and the pcb's that were normal
Electronics Forum | Sun Oct 19 08:11:12 EDT 2008 | davef
While you're waiting for others to reply to your question on component analysis laboratories, search the fine SMTnet Archives to find posts like: http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=35636
Electronics Forum | Tue Oct 21 10:57:15 EDT 2008 | arosario
Hi Dave, thanks for the info. I'll check the detail and try to send sample SMD's for test. - Bong
Electronics Forum | Tue Oct 21 11:19:30 EDT 2008 | ljohnson
Sounds to me like your printer not releasing paste now and again. How can you be sure that you are not getting print skips. Are you using any kind on AOI?
Electronics Forum | Tue Sep 04 11:09:25 EDT 2001 | blnorman
As the others have stated, moisture is the killer. You have to be sure no moisture is allowed to get to the paste. If it does, you'll get solderballs. I would suggest not using a vacuum. The solvents and other volatile components of the flux will
Electronics Forum | Wed Sep 26 14:58:46 EDT 2001 | bobm
i have stored boards in the refrigerator in side a tray (with a lid) for 2 days and still had them reflow with no problems. i don't know if i would go any longer than that. i would not put any qfp's or any other device that is moisture sensative dev
Electronics Forum | Tue Sep 04 09:12:35 EDT 2001 | caldon
Moisture would be my main concern. Even though components are plastic, they can absorb moisture. Moisture is also detrimental to the the solder itself. The water droplets that are left behind (evaporated even) could cause problems (i.e. chlorides).
Electronics Forum | Thu Sep 06 22:34:15 EDT 2001 | davef
The more we talk about this, the more it seems like you should use the process we've discussed to proof your design. Immediately there after, you should use a top-flight high-mix contractor to continue the prototype run for you. If you don't have t
.gif)
