Electronics Forum | Wed Feb 07 09:46:20 EST 2001 | pjc
I need some guidance here. I've got a new board w/ a FBGA-48 package, Samsung CMOS SRAM. It's a full matrix BGA w/ 0.30mm-0.40mm ball diameter @ 0.75mm pitch. Balls are eutectic. PCB land diameter is 0.4mm. There are TSOP I 0.5mm lead pitch component
Electronics Forum | Sat Mar 24 00:50:24 EST 2001 | PeteC
Fresh paste from a factory sealed container. Should paste be scrapped out altogether if left on the stencil for too long (length-of-time?)? Our paste is Multicore CR39. Multicore reccomended the print chamber be around 22C @ 50%-60% RH. Our plant is
Electronics Forum | Fri Mar 07 05:36:21 EST 2003 | O' Connor
Hi Again, In answer to DaveF - Yes solder is fine where the solder paste is deposited , but the part of the pad visible after pasting is still visible after reflow. Previously the solder paste & all the gold diffused & flowed giving a complete silve
Electronics Forum | Wed Aug 31 06:33:04 EDT 2005 | Slaine
if a solder has over 85% lead its classed as RoHS complient because its difficult to achive the same melting point with anything else (298degrees). a few other alloys with a similar range are ; % % 266E266 82.6 Cd 17.4 Zn 271MP 100 Bi 280E2
Electronics Forum | Fri May 04 13:42:11 EDT 2012 | spoiltforchoice
The Manncorp machines are Autotronik machines re-branded. These are Chinese built while pretending to be German, they are seemingly capable enough and do come in at very attractive price points. The FLX from Essemtec is in many ways a slicker machine
