Industry News: mpm and 3d (Page 2 of 44)

2009 International Wafer-Level Packaging Conference Dates and Location Announced

Industry News | 2008-12-06 02:26:28.0

Minneapolis, MN � The SMTA and Chip Scale Review Magazine are pleased to announce the dates for the 2009 International Wafer-Level Packaging Conference. The 6th annual offering of the IWLPC will be held on October 27-30, 2009 at the Santa Clara Marriott in Santa Clara, California.

Surface Mount Technology Association (SMTA)

International Wafer-Level Packaging Conference (IWLPC) Program Announced and Registration Now Open

Industry News | 2019-07-16 19:36:51.0

The Surface Mount Technology Association (SMTA) and Chip Scale Review are pleased to announce the program for the 16th annual International Wafer-Level Packaging Conference (IWLPC). The conference will be held October 22-24, 2019 at the DoubleTree by Hilton Hotel in San Jose, California.

Surface Mount Technology Association (SMTA)

SMTA International Conference Program Finalized and Registration Now Open

Industry News | 2017-06-08 15:11:11.0

The SMTA is pleased to announce that the program for the SMTA International Conference and Exhibition is finalized and available on-line at www.smta.org/smtai and registration is open. Taking place September 17-21, 2017 at the Donald Stephens Convention Center in Rosemont, Illinois, the conference features 20 workshops, 130 technical papers, and numerous complimentary offerings for engineers and professionals in the electronics manufacturing industry.

Surface Mount Technology Association (SMTA)

SMTA Announces International Conference on Soldering and Reliability (ICSR) Program

Industry News | 2013-04-02 17:20:44.0

The SMTA is pleased to announce the program for the 2013 International Conference on Soldering and Reliability being held May 14-17 in Toronto, Ontario, Canada.

Surface Mount Technology Association (SMTA)

International Wafer-Level Packaging Conference (IWLPC) Program Finalized and Registration Now Open

Industry News | 2013-07-19 11:27:23.0

The SMTA and Chip Scale Review magazine are pleased to announce the presentation line-up for the 10th Annual International Wafer-Level Packaging Conference.

Surface Mount Technology Association (SMTA)

International Wafer-Level Packaging Conference (IWLPC) Program Finalized and On-line Registration Now Open

Industry News | 2009-07-24 14:12:49.0

Minneapolis, MN – The SMTA and Chip Scale Review magazine are pleased to announce the presentation line-up for the 6th Annual International Wafer-Level Packaging Conference. The IWLPC will be held October 27-30, 2009 at the Santa Clara Marriott Hotel in Santa Clara, California.

Surface Mount Technology Association (SMTA)

Evolving Technologies Summit Focuses on Printed Electronics, Packaging Technology, and Materials at SMTA International

Industry News | 2013-07-23 16:35:08.0

The SMTA announced that the Evolving Technologies Summit will be held on October 14, 2013 as a focused symposium at SMTA International in Fort Worth, Texas.

Surface Mount Technology Association (SMTA)

SMTA Capital Chapter’s Expo and Tech Forum to be Held on August 30th

Industry News | 2016-08-03 20:48:00.0

The SMTA Capital Chapter is pleased to invite you to its upcoming Capital Expo and Tech Forum at Johns Hopkins University / Applied Physics Lab, Kossiakoff Center, 11100 Johns Hopkins Road,Laurel, MD 20723, on Tuesday, August 30th.

Surface Mount Technology Association (SMTA)

International Wafer-Level Packaging Conference (IWLPC) Program Announced and Registration Now Open

Industry News | 2017-07-19 15:29:48.0

The SMTA and Chip Scale Review are pleased to announce the program for the 14th annual International Wafer-Level Packaging Conference. The IWLPC will be held October 24-26, 2017 at the DoubleTree by Hilton Hotel in San Jose, California.

Surface Mount Technology Association (SMTA)


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