Electronics Forum | Thu Feb 10 11:29:19 EST 2011 | patrickbruneel
If you search the documents for tin whiskers it’s getting very interesting. Also you can find in the report that lead-free (SAC) solder is used. http://www.nhtsa.gov/staticfiles/nvs/pdf/NASA-UA_report.pdf This report also confirms that the board
Electronics Forum | Tue Oct 11 14:42:15 EDT 2005 | patrickbruneel
NASA website on Tin whiskers: http://nepp.nasa.gov/whisker/ NEMI Tin whisker activities: http://www.inemi.org/cms/projects/ese/tin_whisker_activities.html CALCE Tin Whisker Working Group: http://www.calce.umd.edu/lead-free/tin-whiskers/ Measur
Electronics Forum | Wed Nov 21 10:15:53 EST 2007 | davef
On one hand, maybe National Aeronautics and Space Administration standards are a good starting point to establish standards for ruggedized manufacturing practice. Look here: http://workmanship.nasa.gov/wkstds_nasa.jsp On the other hand, as you say
Electronics Forum | Thu Mar 12 21:14:16 EDT 2009 | davef
Mask: * I/O connector contact surfaces * Bus connector contact surfaces * Configuration jumper blocks * Test points * Surfaces that contact heat sinks (heat sinks are removed prior to coating) * Board mounting holes * Adjustable potentiometers * P
Electronics Forum | Tue Jun 13 22:42:36 EDT 2000 | Dave F
Jeff: Last place I can recall seeing something like that is NASA-STD-8739.3 Requirements like this are not currently in vogue. A modern solder process should conform to J-STD-001, which makes no mention of prebaking boards.
Electronics Forum | Tue Jul 23 14:17:46 EDT 2002 | davef
Hell-loooow!!! Why not contact the document author? Try: Reza Ghaffarian - Reza.Ghaffarian@jpl.nasa.gov Jet Propulsion Laboratory Phone: 818 354-2059 | FAX: 818 393-5245
Electronics Forum | Wed Sep 17 15:44:28 EDT 2003 | davef
Look here: http://nepp.nasa.gov/DocUploads/CE5125B5-E0EB-4CFA-8867BE3F3E342CA5/moisture%20effect%20Ta%202C%20M.pdf
Electronics Forum | Fri May 14 14:35:51 EDT 2004 | davef
Try: * NASA-STD-8739.1 Workmanship Standards For Staking And Conformal Coating Of Printed Wiring Boards And Electronic Assemblies * NHB 5300.4(3J) Requirements for Conformal Coating and Staking of Printed Wiring Boards and Electronic Assemblies
Electronics Forum | Wed Aug 04 18:38:53 EDT 2004 | davef
whiskers / "matte" => no whiskers. Look here: http://nepp.nasa.gov/whisker/anecdote/20year/ There. Nice going. What a buzz killer. I've got to got find some donuts, cold pizza, er whatever.
Electronics Forum | Wed Dec 01 15:56:53 EST 2004 | fescsteve
Frontier Electronic Systems Corp. Stillwater, OK www.FESCorp.com IPC Class I - III and NASA Space qualified Quick turn-arounds to moderate volume. Steve
