Electronics Forum | Mon Dec 20 08:23:30 EST 2010 | johanhuizing
The buyers in our company like to change the PCB finishing because of reducing costs. The proposed change is going from Ni/Au to HASL lead free, I know that in the beginning of the lead free period there where a lot of problems to use the HASL especi
Electronics Forum | Mon Apr 29 05:25:13 EDT 2002 | ianchan
Hi, we do Sn plated I/O pinning insertion into Ni/Au thru' holes. no problems here so far, as we cater for the "interference" (fit-allowances) of the I/O pin into the thru' diameter, via improved PCB thru' hole designs. before this cater/considerati
Electronics Forum | Thu May 18 11:27:36 EDT 2006 | patrickbruneel
I'm not on the production floor on a daily basis like the other guys here but here's my 2 cents: With a Ni/Au plating the inter-metallic that needs to be formed is Ni/Sn. Ni/Sn inter-metallic requires higher peak assembly temperature and a longer dwe
Electronics Forum | Tue Mar 14 21:09:20 EST 2000 | Dave F
Emmanuel: Take Jax's word. NiAu (ENIG) primary (some would say only) redeeming characteristic is its flatness that you mentioned, but that flatness appeals to folk placing fine pitch devices, rather than BGA. Good luck. Dave F
Electronics Forum | Mon May 01 15:04:15 EDT 2000 | Ernie Miller
I need a good cleaning cycle for leaded brass (CuZn39Pb3). Product to be ni/au loose peice plated
Electronics Forum | Tue Mar 14 21:09:20 EST 2000 | Dave F
Emmanuel: Take Jax's word. NiAu (ENIG) primary (some would say only) redeeming characteristic is its flatness that you mentioned, but that flatness appeals to folk placing fine pitch devices, rather than BGA. Good luck. Dave F
Electronics Forum | Thu Jun 14 13:41:06 EDT 2001 | bentzen
Thanks a lot Dave. I think I will stay away from OSP. I just thought that it could be a cheaper solution than NiAU for fine pitch. And I don�t trust the silver coating types. Brian
Electronics Forum | Thu Feb 04 16:26:59 EST 1999 | Chuck Morehouse
I am interested in the opinions of those who have done experiements or have experience with HASL, OSP's, Palladium, Ni/Au , and White Tin PWB plating. Based on your experience please give me the pro's and con's of using these plating options. Thank
Electronics Forum | Tue Oct 06 16:50:51 EDT 1998 | Manish
Hello Everybody Would anyone of you know about the impurities in the Ni/Au pad metallurgy (board side metallurgy) affecting the assembly of the chip on the board. I was told that impurities in gold may lead to void formation in the solder bumps.
Electronics Forum | Mon Apr 29 03:16:43 EDT 2002 | Bob Willis
I have only seem problems so I would suggest you don't do it.
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