Electronics Forum | Tue Nov 10 15:01:50 EST 2009 | rgduval
Check out this paper: http://www.xs4all.nl/~tersted/PDF_files/Plexus/tombstoning.pdf You can also search the SMTnet archives for more information. If you're tombstones are random as you describe, likely the problem is not with the profile; but som
Electronics Forum | Fri Dec 02 10:11:01 EST 2016 | tombstonesmt
We successfully accomplish this on almost every product we have using our BTU Ovens.
Electronics Forum | Wed Apr 06 11:58:38 EDT 2011 | gaz
ok, thanks very much for your help.
Electronics Forum | Thu Mar 31 08:50:18 EDT 2011 | rgduval
While you're waiting, consider giving your paste manufacturer a call. They should have a database of recommended, or starting point profiles based on what oven you have. cheers, ..rob
Electronics Forum | Wed Mar 30 17:32:55 EDT 2011 | gaz
Hi, We are using ws488 sn100c paste. Anyone have a profile for a 5 zone oven that has worked well for you?
Electronics Forum | Mon Jan 09 19:25:15 EST 2017 | fadzril
It shouldn't be any issue if you measure the top reflow settings using bottom profile board & the results are OK. To common the reflow profile, both bottom & top profile measurement are taken & analyzed. This, too, can be applied, even for differen
Electronics Forum | Mon Apr 04 12:39:00 EDT 2011 | gaz
This VIP70 has thermocouple inputs, so I'm hoping that's a good enough profiler. I tried a fairly different profile than you mentioned, so will test your settings today as well. If anyone has opinions, please jump in. Thanks!
Electronics Forum | Wed Jan 25 07:18:03 EST 2017 | emeto
If you prefer to use same profile - it will be fine most of the time. There are several things to consider. 1. Is there part on second side that cannot withstand temperatures from first side? 2. If there is a high mass component on first side, that
Electronics Forum | Thu Jan 26 12:46:53 EST 2017 | dyoungquist
We run double sided boards that have large SMT electrolytic caps on the top side using the same profile for both sides. The trick is to do the bottom side first, then the top side. That way you do not need to glue down the large caps.
Electronics Forum | Wed Jan 25 00:29:22 EST 2017 | cmarasigan
This is our practice already, common profile both sides and we perform it during NPI stage. As long as zone settings are the same and profile requirements are meet, we consider it as same profile and no need to re-profile from bottom side process to