Electronics Forum | Tue Aug 22 11:23:40 EDT 2000 | Dr. Ning-Cheng Lee
Plating houses seem to exhibit various results. Unacceptable Ni oxidation levels appear to be related to poor Pd plating processes. Ni oxidation can occur at 3 process stages: 1) prior to the Pd being applied (Ni already oxidized) 2) during the p
Electronics Forum | Tue Mar 19 07:48:26 EST 2002 | PeteC
Have QFP at o.5mm pitch with leads too oxidized for the flux in the paste to de-oxidize(in stock for boo koo time). I saw three companies on the Internet that can "tin" (solder coat) the leads. Does anybody have any experience with having this done t
Electronics Forum | Tue Feb 14 09:29:46 EST 2006 | pjc
�..... their material acts as a barrier to oxidation," is wrong Mr. N. The MS2 material "consumes" oxides therefore removing the oxides from the dross by chemical reaction and releases the pure alloy. It is not a barrier and does not mix into the sol
Electronics Forum | Wed Sep 04 22:48:13 EDT 2013 | winson16
SMT fine pitch connector having oxidation on lead and P&P machine keep rejecting the part. Is there any alternative way to reduce the part throw out rate without jeopardize the placement accuracy? Or is it possible to re-coat the connector lead or an
Electronics Forum | Mon Mar 20 13:56:04 EDT 2017 | pjc
Kleenox is designed for cleaning and protecting the solder bath in wave solder pots from air oxidation and formation. Kleenox is formulated to remove oxides. Kleenox can be used with tin/lead and lead-free solder. http://www.americancleanstat.com/k
Electronics Forum | Mon Jan 21 11:41:39 EST 2019 | SMTA-Tony
Lead free HASL coatings can be susceptible to yellowing during reflow due to oxidation of the tin in the coating. Some HASL solder suppliers use anti-oxidant additives in the solder to limit or prevent yellowing of the coating. You may want to ask
Electronics Forum | Mon May 17 13:21:45 EDT 2021 | SMTA-64387881
PWB Bake out or other elevated temperture processes can cause issues with oxidation of that Nickel layer. The gold porosity can vary from batch to batch, but also process changes can contribute. Are you baking the boards or have previous reflow pro
Electronics Forum | Wed Nov 08 15:32:45 EST 2000 | CAL
ACI offers solderability restoration services by using Reduced Oxide Soldering Activation (ROSA) technology to remove the oxide layers from circuit boards or components and then re-tin or otherwise coat them to maintain a solderable surface. The R
Electronics Forum | Mon Dec 20 21:01:12 EST 2004 | davef
Bare inconel is NOT ment to take solder, because * Nickel develops a tenacious oxide layer that is very difficult to remove since the nature of the oxide is very dense, coherent, etc. * Chromium is difficult to solder. * Iron is difficult to solder.
Electronics Forum | Thu Sep 27 17:25:33 EDT 2007 | chef
The short answer is immediately after reflow the problem occurs. To be more exact, what you are describing is not "rust". Rust occurs in iron. The oxidation that occurs in Tin-Lead has been sometimes called "white rust". Either way, oxidation occur
