Industry News | 2003-04-15 08:57:18.0
First Implementation of the Package Platform Delivers 50-percent Cost, 60-percent Height, and 75-percent Area Reductions over Conventional RF Module Technologies
Industry News | 2003-05-22 08:36:27.0
Packaging Saves PCB Board Space Without Sacrificing Power Dissipation Capability
Industry News | 2015-06-11 16:02:18.0
MIRTEC, "The Global Leader in Inspection Technology," will exhibit its most recent solutions for System in Package (SiP) inspection and measurement at SEMICON WEST 2015; July 14-16, 2015, at the Moscone Center in San Francisco, CA. Visitors are invited to booth # 2343 for a detailed demonstration of this exciting new technology.
Industry News | 2014-06-22 19:12:37.0
MIRTEC, “The Global Leader in Inspection Technology,” will exhibit in Booth #5444-1 at SEMICON West 2014, scheduled to take place July 8-10 at the Moscone Center in San Francisco, CA.
Industry News | 2003-03-26 08:25:40.0
The QVE00033 transmissive switch's small size, surface mount package and performance make it ideal for noncontact switching applications in disk drives, card detectors, mise and trackballs.
Industry News | 2003-03-25 09:24:51.0
The Cadstar Universal package enables educational establishments to provide multiple licences of current generation PCB design solutions for students at a cost equivalent to a standard single licence.
Industry News | 2003-05-08 07:22:00.0
Over 400 contract manufacturers present every aspect of outsource capability.
Industry News | 2008-07-19 15:38:37.0
OXFORD, CT � July 16, 2008 � MIRTEC, the global leader in Automated Optical Inspection Technology, announces that its MV-7L In-Line AOI System was named First Finalist in the category of Inspection Equipment & Services during the Advanced Packaging Award ceremony that took place on Wednesday, July 16, 2008 at the St. Regis Hotel Conservatory during the SEMICON West exhibition in San Francisco.
Industry News | 2013-11-13 12:39:14.0
MIRTEC, “The Global Leader in Inspection Technology,” announces that it was awarded a 2013 Global Technology Award in the category of LED Production Equipment for its MV-9XP LED Package Inspection System.
Industry News | 2003-05-28 08:28:54.0
For June 2-4 (Mon. - Wed.)Design Automation Conference 2003
