Electronics Forum | Fri Nov 23 16:09:01 EST 2007 | davef
We're not real clear about what you're trying to discuss, because most capacitors are packaged in epoxy with a solderable termination on each end. But lets throw a couple of ideas at the wall and see what sticks. If this epoxy is: * From the capaci
Electronics Forum | Wed Aug 13 21:03:01 EDT 2003 | davef
Your dust collection / humidity / ionic path concern is reasonable. Consider applying your conformal material thick enough to form a good barrier between the device edge and the board, similar to what you do for QFP. [Admittedly the QFP is not a pre
Electronics Forum | Tue Mar 15 09:32:49 EST 2005 | Sandy Kelley
I have been engaged to find an Applications Engineer for an electronic materials division of a worldwide multi-billion dollar diversified international specialty chemical endeavor. My client is a well respected, cutting edge technology leader in un
Electronics Forum | Tue Mar 15 09:34:31 EST 2005 | Sandy Kelley
I have been engaged to find an Applications Engineer for an electronic materials division of a worldwide multi-billion dollar diversified international specialty chemical endeavor. My client is a well respected, cutting edge technology leader in un
Electronics Forum | Thu Sep 23 10:28:48 EDT 1999 | Wolfgang Busko
| Hi All, | | I'm recently receiving an IC in package for Ic's sensitive to moisture and not in another times, Somebody know how can I know if this Is moisture sensitive or not(which is the rule ?)?. the Ic is a soic14. | | | thanks | | I appreci
Electronics Forum | Fri Mar 14 11:05:26 EST 2003 | steves
Garth, Try searching on "capacity planning." This is a standard tool available in most MRP and ERP software packages. You may already own it in whatever software package you use for your material planning. Steve
Electronics Forum | Wed Jun 19 22:03:23 EDT 2002 | davef
If you can assemble flawless products with these boards, do not be concerned about post-assembly quality issues. There is no current related specification in the US. Although, there may be some old military specifications that apply, but you would
Electronics Forum | Wed Apr 05 08:51:25 EDT 2000 | Wolfgang Busko
Emmanuel: Popcorn effect is mostly caused by entrapped moisture in the components package material. Plastic ICs are known for absorbing and storing moisture when exposed to normal factory conditions. They should be stored in an moisture reduced envir
Electronics Forum | Sat Nov 06 14:39:50 EST 1999 | Gary Moravchik
I am seeking sources of reliability and thermal stress data that compares BGA (50mil ball pitch) to QFP (20mil lead pitch)packaging for automative applications. Substrate material is epoxy glass. The ultimate goal is to collect sufficient data to hel
Electronics Forum | Mon Apr 08 00:08:00 EDT 2019 | jamestong
With the increase of labor costs, the popularity of automated production lines, IC tubes, connector tubes, power module tubes, LED tubes, relay tubes and other electronic components tubes are also becoming more widely used. Many small companies blind
