Industry News | 2018-10-18 08:32:52.0
How to Prevent Solder Ball and Bridging Defects during the SMT Reflow Process
Industry News | 2018-01-24 20:47:58.0
SHENMAO America today announced plans to exhibit in Booth #2344 at the 2018 IPC APEX EXPO, scheduled to take place Feb. 27 - March 1, 2018 at the San Diego Convention Center in Ca. The company’s new PF606-P140 / PF606-P245 Lead-free Zero Halogen Solder Pastes can eliminate Head-in-pillow (HiP) defects, voids, slumping, non-wetting opens and short stencil life.
Industry News | 2022-06-24 10:18:52.0
Seika Machinery, Inc. is pleased to introduce Malcom's new flagship CE certified viscometer as the industry standard for testing solder paste viscosity. The new Malcom PCU-285 Viscometer features an onboard PC with a full LCD touchscreen display. The heating also has been improved for faster and more stable temperature control.
Industry News | 2023-03-16 14:42:07.0
SHENMAO America, Inc. has released its new Anti-HoP Lead-Free Solder Paste PF606-P130N. The paste is specially designed for the SMT process to prevent head-on-pillow (HoP) issues.
Industry News | 2010-04-11 03:15:20.0
The Balver Zinn Group announces that Cobar Europe BV has been awarded an NPI Award in the category of Soldering Materials for its Aquasol Branded Water Soluble solder paste. The award was presented to the Stan Renals, CEO of the Cobar Division during a Tuesday, April 6, 2010 ceremony that took place in the Mandalay Bay Resort & Convention Center in Las Vegas during APEX 2010.
Industry News | 2010-10-26 22:46:06.0
FCT Assembly introduces the new NC676 no-clean leaded solder paste, featuring its latest technology in print and reflow in the no-clean category.
Industry News | 2010-04-10 23:59:50.0
LOS ALAMITOS, CA - Following the success of their 2007 test board and kit, Practical Components and Aim Solder have updated their offering with a new AIM print test board and kit that is designed to include many printing challenges commonly found in manufacturers' assemblies.
Industry News | 2021-10-18 15:09:32.0
Insituware LLC is pleased to announce that Morgan Miller, Application Engineer, will present during the SMTA International Conference, scheduled to take place Nov. 1-4, 2021 at the Minneapolis Convention Center. Ms. Miller will present: "Correlation of Solder Paste Electrochemical Impedance Spectroscopy (EIS) Measurements to Solder Paste Inspection (SPI) Performance."
Industry News | 2018-10-18 08:44:36.0
Lead-free Reflow Profile: Soaking type vs. Slumping type
Industry News | 2010-03-24 12:57:09.0
GREELEY, CO — FCT Assembly to highlight its range of new solder pastes in booth 2317 at the upcoming IPC/APEX conference and exhibition, scheduled to take place April 6-8, 2010 at the Mandalay Bay Resort & Convention Center in Las Vegas.
