New Equipment | Assembly Services
At the stage where production PCB assembly is being planned, many other factors come into play, particularly Design-for-Test (DFT) and Design-for-Manufacturability (DFM) issues, making sure documentation is current, planning diagnostics tests and mac
The Fuji NXT is designed to meet the demands of modern production environments. Its interchangeable placement heads allow each machine module to function as either a high speed chip mounter or a multi-function placement machine. Heads are fast and
PanaCIM™ Enterprise Edition is a manufacturing execution system (MES) software solution offering new levels of capability across your entire enterprise. This portfolio integrates cooperating software products in a networked environment to solve key p
Maybe you should sit down ! In case you missed it, the flexible pick and place market has been changed forever. Everything you knew about pick and place machines needs to be revised. now is a good time to learn how europlacer has resolved the list
Epoxy 4089 is a single part, epoxy adhesive used for bonding SMT components to a PWB prior to double sided reflow or wave solder assembly. Epoxy 4089 has been formulated for use in all types of high speed dispensing equipment including air pressure,
When time to market is the driving force, fast alternatives to pilot production runs can be the key to success. LPKF UV laser systems provide the flexibility, reliability and high precision that customers demand. By reducing product changeover time
New Equipment | Assembly Services
The Microelectronics Lab was established to meet the rising need for advanced systems development and packaging to address the emerging challenges and issues facing today’s electronics assemblies. Advanced design and modeling software enables STI to
New Equipment | Tape and Reel Equipment
ALPHA® Exactalloy® Preforms in tape and reel packaging are used with solder paste to selectively increase solder volume using standard pick and place equipment. The preform is placed directly into the solder paste prior to assembly reflow. Alpha So
FUJI NXT Applicable Components: 0201 Board size:330×250mm Feeder inputs:20 placement capacity: 22,500CPH Product description: FUJI NXT Chip Mounter, High Speed modular Mounter, Applicable Components: 0201,Board size:330×250mm,Feeder
FUJI NXT Chip Mounter Applicable Components Board size:330×250mm Feeder inputs:20 placement capacity: 22,500CPH Product description: FUJI NXT Chip Mounter, High Speed modular Mounter, Board size:330×250mm, Feeder inputs:20, placeme
