Electronics Forum: plated vias (Page 2 of 22)

Plated through via's in pads.

Electronics Forum | Wed Feb 05 17:37:40 EST 2003 | mk

Investigate "Solid Solder Deposition"

LGA voiding

Electronics Forum | Tue Jan 07 17:33:26 EST 2020 | SMTA-Norah

Were the boards baked out before soldering? Is there plated over vias in the pads?

Re: Vias Under Discrete Components

Electronics Forum | Wed Mar 15 20:28:17 EST 2000 | Dave F

Armin: Locating vias within the courtyard of components is bad practice. Concerns are: * Poor solder paste print quality, caused by the via preventing good stencil gasketing. * Poor component reflow, caused by the via holding the component out o

via in pad

Electronics Forum | Sat Oct 12 06:43:49 EDT 2002 | davef

Alternatives to consider are: * Opening-up your stencil aperture put-down more paste to compensate for the amount that is being used to fill the via. * Relaying-out the board to plug and plate over the via. * Relaying-out the board to move the via fr

Filling via holes during the reflow process

Electronics Forum | Mon Mar 04 17:52:59 EST 2002 | davef

Yes, providing the surface of the via is solderable. * If so, how much paste? => Vias come in various sizes. Boards vary in thickness. So, the amount of paste to fill a via varies. Roughly, you�ll need twice as much paste as the volume of the via

Plated through via's in pads.

Electronics Forum | Wed Feb 05 19:43:34 EST 2003 | iman

If by the Powers Ta Be (customer/designer), you can't change the PCB design, negotiate for the PCB fab house, to block the via holes with their (green?) solder mask some customers/designers want to have via holes to be present in the PCB pad, due to

Plating Thickness at Via Hole

Electronics Forum | Fri Aug 06 07:16:36 EDT 2004 | davef

When moisture outgasses through plating, it continues through the molten solder, causing a meak solder connection. There's another issue with thin plating that we haven't focused on in this thread. If plating is thin, the stress on the barrel of a

Large Voids with Via in Pad

Electronics Forum | Mon Apr 12 22:22:01 EDT 2004 | davef

Large voids are common in via in pad [seach the fine SMTnet Archives for earlier laments], especially in blind via. Observations on your via out gassing theory: * If the copper plating on your via is GT 1 thou, there will be no outgassing from the

Solder Mask On Gold

Electronics Forum | Fri May 28 15:50:48 EDT 1999 | Frank Boyko

We now put soldermask on copper and then immersion nickel/gold plate our fine line boards. One of our vendors says this causes skipped plating in small via holes and wants to nickel/gold plate the whole board, including via holes, and then apply sold

BGA via in pad

Electronics Forum | Fri Mar 16 17:15:51 EDT 2007 | davef

Ask the board fabricator to: * Fill the vias with resin. * Then metalize and copper plate the filled via along with the pad. * Then plate with solderability protection. This results in what appears to be a solid pad. For more, look here: http://www


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