Electronics Forum | Thu Nov 09 17:54:54 EST 2006 | russ
I would trust that you are benchmarking some design rules as well? Yield is directly related to design as well as process capability. anyway 95% is not a bad first pass yield at all, and I would tend to think that that is a little high when dealing
Electronics Forum | Thu Nov 23 09:41:36 EST 2006 | Jon
The DPMO is a far better measure - first pass yield doesn't give you any indication on quality or effectiveness of test step. If you want 100% first pass yield, test nothing - works every time - you see where I am coming from..........
Electronics Forum | Thu Feb 07 11:59:48 EST 2002 | Ron Costa
When double sided BGA's are used on an .062 FR4 10 layer board should via's be plugged and tented? The CACHE chips being used are PBGA's 1.27mm pitch. The pad size is .030 and the finished via dia. is .010. This is a dogbone type pad and via design.
Electronics Forum | Fri Sep 13 14:37:24 EDT 2002 | norvica
I have an Altai mains adapter. Input 240v ac Output 3,4.5,6,7.5,9,12 v dc 300mA MAX It has a polarity plug where you plug in the lead. I want to run a 3v Fuji film digital camera. Do i plug in the plug so the + goes to the - or the + goes to the +
Electronics Forum | Wed May 19 11:50:32 EDT 1999 | Chris Nuttall
We care currently running into problems during our plug via process: At the moment we plug prior to soldermask (LPISM) using epoxy resin - plugging takes place from the component side - however we are seeing solderballs after solder level.This is cau
Electronics Forum | Thu Aug 25 10:17:48 EDT 2005 | davef
Send the pic to dave5252 at hotmail.com [you can't send pic through the SMTnet email thing] For more on via plugging, tenting, capping ... look here: http://www.merix.com/technology.php?section=processes&page=pdf/Via_Fill_Plug.pdf Something, a voi
Electronics Forum | Wed May 19 13:13:20 EDT 1999 | Dave F
| We care currently running into problems during our plug via process: | At the moment we plug prior to soldermask (LPISM) using epoxy resin - plugging takes place from the component side - however we are seeing solderballs after solder level.This is
Electronics Forum | Thu May 20 07:53:55 EDT 1999 | Chris Nuttall
| | We care currently running into problems during our plug via process: | | At the moment we plug prior to soldermask (LPISM) using epoxy resin - plugging takes place from the component side - however we are seeing solderballs after solder level.Thi
Electronics Forum | Wed Jul 23 08:18:29 EDT 2008 | davef
Q1. Is this a standard process for plugging? A1. Not as such. We checked both IPC-6012 and IPC-SM-840. Neither comments on plugging. So, your fabrication notes rule the day. Q2. Is this okay for such thick PCB's or is it mandatory to use a special pl
Electronics Forum | Tue Feb 18 18:16:57 EST 2020 | jerlong2020
We are having issues with solder flooding some through hole pin receptacles which have an organic fiber plug on the soldering end. Anyone else use these types of receptacles and soldering with selective solder. Appears the plugs may be not sealed w
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