Electronics Forum | Fri Apr 11 03:28:11 EDT 2008 | joseph_gonzales16
Tak time is depend on the solder paste requirement all solder paste there are deferent tak time.
Electronics Forum | Thu Jan 05 15:30:19 EST 2006 | samir
Pure ignorance is my answer to that.... You're with a CM, right?? Your idiot customer probably has never stepped foot on a manufacturing floor in his entire gott-damn life, but.... he reads SMT Magazine every month, and probably read some article
Electronics Forum | Fri Aug 20 11:34:11 EDT 2004 | soease
Hi Grant, sly again. I was searching for some infos about Auto-SIR, and I found something that may interrest you; Concoat, wich is the company who sells Auto-SIR systems, also has profiling tools and they seem to have a more powerful software to ana
Electronics Forum | Tue Mar 07 09:21:28 EST 2017 | buckcho
Hello, it is similar to the normal ones. You just have to collect 2 thermo profiles for each side and decide in the middle, so all your component heat requirements are met. Sometime it is very hard if the panel has a big variation in components.
Electronics Forum | Wed Apr 21 17:27:27 EDT 2004 | russ
We always use the regular production reflow profile when we use this method. Since you don't want to do that, All that is required is to ramp the part up to temp to get the balls to melt. If you don't exceed 2C per sec. in a ramp you will be fine.
Electronics Forum | Tue Dec 23 10:31:46 EST 2014 | jimpat
Sounds like your volumes are pretty low. Pick and Place is the bottleneck in the assembly line. Consider an oven that can keep up with the throughput of your P&P. "The best" is determined on individual cases for a specific application and enviro
Electronics Forum | Sun Nov 20 08:22:27 EST 2005 | stepheniii
It can also depend on the board. A board with 160 through hole BNC's requires more spacing than most boards.
Electronics Forum | Tue Feb 11 13:22:22 EST 2020 | rgduval
Sebas, I suspect that your finding of needing the fillet for the card to work is a false finding. One that I dealt with for many years in assembly. As a bottom terminated device, a fillet to the side terminals of the device is not required. Adequ
Electronics Forum | Thu Jul 20 17:01:26 EDT 2000 | Bob Willis
Here is some further information on SDSRS process, but please purchase a copy of the report from t he SMTA as all the money goes to charity. In the UK the SMART Group raised over �3000 for the homeless. SMTA have been raising a lot of money for the G
Electronics Forum | Thu Aug 27 11:18:05 EDT 2015 | dyoungquist
From your description I am assuming you are doing double sided reflow and parts are dropping off the bottom side when the board is run through the reflow oven the second time. A few ideas to try: 1) Are the parts that are dropping off heavier parts
