Electronics Forum | Fri Jan 28 09:05:35 EST 2011 | ldavis
Use tape and reeled solder preforms and place them where ever you need more solder volume.
Electronics Forum | Fri Jan 28 19:26:51 EST 2011 | jlawson
Milara has a combined Stencil printer + jet Printing ??? Print and then jet print areas not printed or top up prints.
Electronics Forum | Fri Mar 29 20:29:13 EDT 2019 | sarason
I would say that is about the best answer to any question ever put on SMTNET sarason
Electronics Forum | Fri Jan 28 04:03:51 EST 2011 | grahamcooper22
Print then dispense in the areas you need extra paste. Why can you not use a stencil which has areas etched away around component patterns to thin the stencil down....for example a 150 micron thick stencil etched to 120 or 100 microns in specific are
Electronics Forum | Sat Mar 30 13:26:33 EDT 2019 | stephendo
Very very few people in the world would have any reason or requirement to know anything about this print head pump. It is a specialized tool for manufacturing of electronics. It would be of no interest to anyone not directly involved with the manufac
Electronics Forum | Fri Mar 29 07:19:32 EDT 2019 | jacoblemaster
I am still in confusion what does it mean? I simply have a heat pump which is the part of the HVAC in my home. It is not used over here I supposed.
Electronics Forum | Fri Mar 29 10:11:02 EDT 2019 | cyber_wolf
“For a number of years now, work has been proceeding in order to bring perfection to the crudely conceived idea of a transmission that would not only supply inverse reactive current for use in unilateral phase detractors, but would also be capable of
Electronics Forum | Wed Mar 23 05:17:23 EDT 2011 | arwankhoiruddin
Hi All. I want to know what is the IPC/JEDEC standard for solder paste printing defects. From the brochures of SPI Machines, the recognized defects are excessive, insufficient, misalignment, no solder, bridging, and solder shape error. What document
Electronics Forum | Fri Mar 25 14:33:26 EDT 2011 | davef
IPC-7525 Stencil Design Guidelines
