Electronics Forum | Mon May 01 15:04:15 EDT 2000 | Ernie Miller
I need a good cleaning cycle for leaded brass (CuZn39Pb3). Product to be ni/au loose peice plated
Electronics Forum | Thu Jun 19 08:00:41 EDT 2003 | shaun
what type of oven do you have . How many zones? and what are the board attributes sizes. We run alot of doublesided reflow with BGA. maybe I can help
Electronics Forum | Fri Jul 11 08:24:58 EDT 2008 | ev
We are a small prototype small volume shop looking at getting more work that involves placing BGA's. What are the concerns or issues that we should be focusing on. We have an ABW 10 zone oven and a Mydata TP11-UFP with a SMT techniques stencil printe
Electronics Forum | Thu Jun 12 03:34:23 EDT 2003 | sanjeevc
I would like to ask a question about SMT reflow > process. I did 10 pcs samples but all is fail. > The sample is double faces to have components > (up-side has 4 pcs of BGA and down-side has 3 BGA > and 2 QFP). And I saw some of BGA which is > t
Electronics Forum | Wed Oct 17 22:59:27 EDT 2001 | mantis
We have the same kind of escalation scale but with shorter times,if the operator cant fix it the technician is called,and this is where we differ slightly the technician will usually know if the problem is going to take some time fixing or wether a v
Electronics Forum | Fri Mar 28 21:43:57 EST 2003 | MA/NY DDave
Hi Yes to your stone question. This pretty much goes with any flux change. Yes to the proper solvent for the flux you choose. Check with the Kester Data Sheets. Kester should have some application sheets which include some No-Clean information.
Electronics Forum | Fri Mar 28 21:54:54 EST 2003 | MA/NY DDave
Hi Notice they do call out that you should use their thinner. In the MSDS you get a clue as to the thinner they are mostly using with some additives. http://www.kester.com/PDF%20FILES/PDF%20Data%20Sheets/E%20No-Clean%20Fluxes/951%20(30Mar98)logo.p
Electronics Forum | Tue Oct 30 22:07:40 EST 2001 | fastek
I spent the better part of 17 years in the middle of such situations. The best advice I can give you is to keep the repairs out of the operators hands as much as possible. This means at a machine down situation, once it is determined that the printer
Electronics Forum | Fri Jul 11 09:37:16 EDT 2008 | realchunks
BGAs are actually easy, but proper stencil design, solder paste placement and oven profiles are a must. Especially oven profiles as this is your only indication that the inner balls have reached proper temp, since you cannot visually tell. If you g
Electronics Forum | Thu Mar 13 15:13:17 EST 2003 | ruggi
That's a good idea...and to add on to it, you could wash after the wave, too--it really doesn't matter. A question about this though--unless your Customer specifically requires "clean", no-clean flux whether it's ugly or not, is permitted by IPC,
