Electronics Forum: pull test after soldering (Page 2 of 78)

Solder wetting test for PCB's

Electronics Forum | Mon Apr 23 14:02:26 EDT 2001 | relensky

I am looking for a repeatble method to determine the quality of solder wetting to a PCB. I would like something that I can perform in-house, at low cost, with reliable results. My goal is to test the wetting on white-tin PCB's, after repeated reflo

BGA failure when chamber test

Electronics Forum | Mon Mar 21 02:41:29 EDT 2011 | kemasta

Hi It's me again. Our products need to pass a chamber test 45c/36hrs after the PCBA completed batch of functional tests and assemble in to case. We found 1 unit was functioning for 24hours in the chamber, but hang after that. We tried to re-boot the

piercing of test vias at ICT

Electronics Forum | Thu Nov 14 09:02:46 EST 2002 | MA/NY DDave

Hi Making contact has been one reported problem, so some testers put in higher force probes that then might cause problems. If fixturing is done correctly, the OSP is done correctly, and test follows close in time after soldering little problems s

piercing of test vias at ICT

Electronics Forum | Fri Nov 15 15:02:37 EST 2002 | MA/NY DDave

OK I know it is funny to have two different PWB/PCB processes, one for pre production and one post production yet it is possible if controlled and implemented in a strategy. In debug if your company's experience has been for a repeated need to do IC

Is test vias a good idea??

Electronics Forum | Mon Jan 31 11:34:58 EST 2005 | Chunks

Testing vias may be acceptable, but not preferred. If you do test by via, it�s a last resort type of thing. Vias are always a pain in the real world. Generally, they are soldered by wave, so they aren�t always doomed correctly, plus residue build-

layer 2 groundplane disconnects after hand solder

Electronics Forum | Mon Apr 13 12:06:53 EDT 2009 | jefflkupkt

BoardHouse, Thanks for the reply. The board supplier did cover the cost of the bare boards. Five years ago I saw a different part pass ET only to fail at final assembly test as well. One engineer called it "acid trap" on the inner layers where the

Re: BGA problem: open after reflow

Electronics Forum | Wed Jan 17 20:48:14 EST 2001 | davef

We find that the raw BGA's pad sheared surface has the SnPb solder at various Z heights whereas the assembled BGAs pad leave a smooth layer of SnPb along the pad. Like to understand the cause for the difference. Who could guess? Solder joint streng

soldering issues

Electronics Forum | Mon May 06 11:49:20 EDT 2002 | Jacob

Hello all, I am having soldering issues with an Everlight component it is a TM4201/TR2 (Right angle IRDA with a 1mm pitch). The problem I have is that after reflow the solder joints look perfect, but during test we are losing 7 micro amps as soon as

warped boarf after reflowing

Electronics Forum | Mon Sep 17 17:33:38 EDT 2012 | kq702

thank you for your reply. I felt like I was using too much heat but I thought it would not work unless I did so. I did not suspect a cold solder joint, however I did another test on a scrap board. I heated the board without my clamps attached (I put

Solder balls after wavesolder

Electronics Forum | Wed Nov 14 20:28:24 EST 2001 | davef

Not to worry. Just run the boards through the cleaner. It will remove all the solder balls. The gross filter on your washer will collect all the solder balls. Coo eh? ;-) How to cure SM? Is your mask UV, er thermal? After learning the type, you


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