| https://www.eptac.com/etrainings/category/620_specialist/
– Online Program This 4-day live online course, for certification, is a comprehensive program that teaches inspection and assembly criteria for all three classes of cable and wire... ( Learn more ) Next Class
| https://www.eptac.com/faqs/ask-helena-leo/ask/shelf-life-of-soldered-components
. 1.1 Scope This standard prescribes test methods, defect definitions, acceptance criteria, and illustrations for assessing the solderability of electronic component leads, terminations, solid wires
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/wire-pull?con=t&page=10
. The standards contain specifications for acceptance or rejection criteria. Small geometry (Ultra Fine Pitch) applications are becoming more and more popular and as such Nordson DAGE offers wire pulling test equipment optimized specifically for this function
| https://www.eptac.com/etrainings/category/620_certification_specialist/
– Online Program This 4-day live online course, for certification, is a comprehensive program that teaches inspection and assembly criteria for all three classes of cable and wire... ( Learn more ) Next Class
| https://www.eptac.com/ask/shelf-life-of-soldered-components/
. 1.1 Scope This standard prescribes test methods, defect definitions, acceptance criteria, and illustrations for assessing the solderability of electronic component leads, terminations, solid wires
| https://fluxconnectivity.com/what-is-ipc-whma-a-620%EF%BB%BF/
. The seemingly random string of characters actually represents the only industry-consensus standard for Requirements and Acceptance of Cable and Wire Harness Assemblies
| https://www.eptac.com/faqs/ask-helena-leo/ask/bridging-two-adjacent-pins-on-an-ic
: Can we bridge two adjacent pins on an IC using bare wire across those two pins? What specification do we reference for the acceptance of the rework performed? Question
| https://www.eptac.com/faqs/ask-helena-leo/ask/failing-to-remove-gold-plating-in-final-assembly
board’s acceptance in final assembly? Question: If the gold plating on the surface of via holes is not removed from the printed circuit boards, does this constitute a defect or failure of the
| https://www.eptac.com/blog/eptac-corporation-releases-ipc-a-610-and-j-std-001-revision-d-to-e-comparison-clinic
. You will receive the new Revision E documents in each class.) What you will learn about the IPC-A-610 Revision E Surface mount criteria Soldering connection requirements Mechanical assembly Depanelization criteria Flex criteria Particulate matter criteria
Blackfox Training Institute, LLC | https://www.blackfox.com/ipc-certification/ipc-specialist/ipcipc-6012-certified-ipc-specialist/
& weave exposure Acceptance testing and frequency Students will demonstrate knowledge of the IPC-6012 performance and qualification criteria by successfully passing an open book written exam
