Industry News | 2016-04-07 09:04:01.0
The SMTA is excited to announce three new workshops for the 10th Annual International Conference on Soldering and Reliability (ICSR) being held May 9-11, 2016 in Toronto, Canada. The event is co-located with the SMTA Toronto Expo.
Industry News | 2016-02-23 20:06:15.0
The SMTA is pleased to announce the program for the 10th Annual International Conference on Soldering and Reliability being held May 9-11, 2016 in Toronto, Canada. The event is co-located with the SMTA Toronto Expo.
Industry News | 2018-10-18 08:40:47.0
Stencil aperture considerations for QFN chips
Industry News | 2014-09-18 17:55:32.0
SMTA China announcing that it presented awards for nine papers at the SMTA China South 2014 Conference Award Presentation Ceremony, held on Tuesday, August 26, 2014 at Shenzhen Convention & Exhibition Center in conjunction with the SMTA China Annual Award Ceremony.
Industry News | 2014-02-11 18:21:25.0
SMTA is very excited to announce the three-day South East Asia Technical Conference on Electronics Assembly Technologies, to be held April 8-10, 2014 at the Eastin Hotel in Penang, Malaysia.
Industry News | 2018-10-18 08:29:16.0
How to Prevent Short Circuits to Ground in QFN Components?
Industry News | 2016-12-20 13:18:31.0
The SMTA is pleased to announce the Best Papers from SMTA International 2016. As speakers at SMTA International, individuals make contributions to the industry by sharing their research and findings. To reward exceptional achievement, $1,000 awards and plaques are given for the Best of Conference Presentation, Best of Proceedings Paper, Best International Paper, as well as a $500 award for Best Student Paper.
Industry News | 2013-09-10 12:18:26.0
The Surface Mount Technology Association (SMTA)'s Intermountain Chapter will hold its annual technical symposium on September 19 at the University of Utah in the Warnock Engineering Building, Salt Lake City, Utah.
Industry News | 2018-10-18 10:24:05.0
The Design Principles of Stencil Apertures
Industry News | 2009-02-21 17:56:00.0
BANNOCKBURN, Ill. and ARLINGTON, Va., USA, February 19, 2009 � IPC � Meeting the requirements of RoHS (restriction of the use of certain hazardous substances in electrical and electronic equipment) compliance and successfully implementing lead-free electronics assembly processes is an ongoing challenge for the electronic interconnect industry. To help companies work toward their compliance goals, IPC and JEDEC present �Transitioning to Lead Free � Strategies for Implementation,� a three-day conference to be held March 3�5, 2009 in Santa Clara, Calif.
winsouce.jpg)
.gif)
