Industry News | 2018-06-17 16:31:20.0
DDM Novastar is pleased to announce the return of Brian Osterhout as DDM Novastar’s director of engineering. Brian has over 30 years of machine design experience, with a broad background in product development and manufacturing. From 2005 to 2010, he worked as Senior Designer & Project Engineer for APS Novastar (DDM Novastar’s previous entity) and helped design the firm’s L Series Pick & Place machine, along with enhancements to the reflow oven and Stencil Printer product lines. From 2010 to the present, Brian continued to expand his knowledge base, working for a Philadelphia manufacturer specializing in fluid-film bearings. This added to his diverse background in fabrication and machining.
Industry News | 2013-09-27 11:37:01.0
DDM Novastar is pleased to announce the launch of the company's newest reflow oven, model GF-125 HC/HT, designed with five zones to provide a longer conveyor length and 2 additional zones to give better control over the soldering profile.
Industry News | 2010-09-24 11:43:04.0
Reflow Oven video providing overview of APS Novastar's Reflow Oven products for lead-free and lead based reflow soldering, curing, and thermal cycling applications.
Industry News | 2014-01-08 18:44:17.0
DDM Novastar is pleased to announce the launch of the company's newest reflow oven, model GF-125 HC/HT, designed with five zones to provide a longer conveyor length and 2 additional zones to give better control over the soldering profile.
Industry News | 2013-08-16 12:04:49.0
DDM Novastar welcomes customers, prospective customers and trade media representatives to attend the company's Open House scheduled for September 12 and 13, 2013.
Higher throughput reflow oven with 20" (508mm) wide conveyor for production runs. The 2000HT reflow oven utilizes our patented Horizontal Convection Heating technology for extremely uniform temperature profiling across the board for enhanced process
Technical Library | 2009-12-23 16:55:08.0
Leading up to the development of lead-free soldering alloys, Horizontal Convection* was developed for the reflow process. Getting the correct temperature profile, with the narrow process window in lead-free applications, is now more important than ever. In each chamber or zone, air is circulated toward one side of the oven above the PCB and toward the opposite side of the oven below the PCB, forming a cyclone around the board. The forced air circulation results in a uniform temperature profile along the entire circuit board assembly. This technology is ideal for the precise profiles needed for lead free soldering.
Industry News | 2014-05-12 11:02:56.0
DDM Novastar introduces new entry-level pick and place machine.
The SF Lead-Free Reflow Oven Series provides higher throughput with a choice of eight (8), ten (10), or twelve (12) heating zones and 17.7" (450mm) adjustable wide conveyor for production runs. Utilizing our patented Horizontal Convection Heating t
Reflow oven with five (5) top and five (5) bottom vertical heating zones, the ERO-500 is an economic solution for low to medium volume production runs. Utilizing plenum convection heating technology, the ERO-500 provides uniform temperature profilin
