Electronics Forum | Tue Feb 14 09:29:46 EST 2006 | pjc
�..... their material acts as a barrier to oxidation," is wrong Mr. N. The MS2 material "consumes" oxides therefore removing the oxides from the dross by chemical reaction and releases the pure alloy. It is not a barrier and does not mix into the sol
Electronics Forum | Thu Jul 30 13:52:34 EDT 2009 | davef
Thoughts are: * 215-220 temperature at the leads is not real hot for leaded assembly. * It's peculiar for component leads to dewet. Sometimes non-wetting occurs along the edge of the lead where the lead is not plated. * How do the leads of a removed
Electronics Forum | Mon May 17 13:21:45 EDT 2021 | SMTA-64387881
PWB Bake out or other elevated temperture processes can cause issues with oxidation of that Nickel layer. The gold porosity can vary from batch to batch, but also process changes can contribute. Are you baking the boards or have previous reflow pro
Electronics Forum | Wed Jul 29 12:48:25 EDT 2009 | mikesewell
Kester R562 is listed as an ORH0, a high activity flux, not sure switching pastes would gain much. What is the finish on the leads? How old are the parts? You could have the parts reconditioned (SixSigma, Corfin, ...others) but this can get costly
Electronics Forum | Thu Mar 12 22:32:49 EDT 2015 | louisg
Hello. I would like to know the difference (if any) between water soluble flux and test socket cleaners (e.g. for Burn-In Board test sockets). As far as I know, they both remove oxides (tin & copper) with an activator, solvent and surfactants. Tha
Electronics Forum | Sat Aug 30 12:36:05 EDT 2008 | omid_juve
we are doing many experiment on this problem 1)sn63 pb37 solder paste +normal profile 2)sn62 pb36 ag2 solder paste +normal profile 3)pb free solder paste + pb free profile 4)sn63 pb37 solder paste + pb free profile but still the problem exist so i th
Electronics Forum | Mon Dec 20 21:01:12 EST 2004 | davef
Bare inconel is NOT ment to take solder, because * Nickel develops a tenacious oxide layer that is very difficult to remove since the nature of the oxide is very dense, coherent, etc. * Chromium is difficult to solder. * Iron is difficult to solder.
Electronics Forum | Sun Mar 15 23:02:16 EDT 2015 | louisg
Thank you Dave! Does that imply that test socket cleaners use a more aggresive/corrosive activator to remove the oxides?
Electronics Forum | Thu Mar 02 20:36:21 EST 2023 | SMTA-71549289
That's great information, thank you. Do you have a particular method for cleaning the nozzle or removing the oxidation on the nozzle? It would be a bummer to use a method that ends up damaging the nozzles.
Electronics Forum | Wed Nov 08 15:32:45 EST 2000 | CAL
ACI offers solderability restoration services by using Reduced Oxide Soldering Activation (ROSA) technology to remove the oxide layers from circuit boards or components and then re-tin or otherwise coat them to maintain a solderable surface. The R
