Electronics Forum: risk (Page 2 of 48)

SMT Production Floor & Component Store/ware house RH Control

Electronics Forum | Tue Jan 23 11:37:13 EST 2007 | electronhose

Here in the Great White North, the best way to check our CM's compliance with the ESD 20.20 is to take a couple months worth of data during heating season and graph it against the outside temp swings. You can easily see how the HVAC system keeps up,

Unsoldered Component

Electronics Forum | Tue Jul 31 18:49:20 EDT 2001 | arsmoriendi

i have a problem with some units that had one capacitor only soldered in one side, the geometry of the capacitor is 0805, our product during his life suffer a lot of stress (due temperature or vibration), some of those units are already with the cost

Leadfree Dross in Wave Solderpot

Electronics Forum | Tue Mar 01 08:59:39 EST 2005 | Marc

Morning All Attended APEX this year and this quesiton came up quite a bit from users. I had some conversations with my co-workers on the wave side and others at the show. Dross is an oxide, lighter than the metals so it floats just as pmdeuel st

ESD question

Electronics Forum | Tue Jul 12 10:04:23 EDT 2005 | slthomas

Try sliding a standard plastic trash can liner in and out of the can a few times, then crumble up a few styrofoam (polystyrene) packing peanuts and dump the bits in. You'll be lucky if any of the bits even reach the bottom, unless it's an ESD safe re

Flux Removal Solvent

Electronics Forum | Fri Mar 09 06:04:18 EST 2007 | phil69

Hi, I am currently looking for a replacement solvent to remove RMA flux from Hybred Ceramic Substrates after reflow. We are currently using Dichloromethane in a Crest AVD500 wash. This solvent carries an R40 risk phrase, hence we are on a drive f

via under a smd pad ?

Electronics Forum | Tue Nov 20 12:31:12 EST 2007 | kelz

In my past experience, having via's under or attached to SMD lands produces risk. Solder will not consistently wick the same if it is being drawn into a via. This has also caused issues from solder wetting through the via to the other side causing a

Question of delamination in PCB

Electronics Forum | Thu May 07 19:29:40 EDT 2009 | kareal

Hi Davef, Do you means it is natural for tin diffusion to copper trace during SMT process? but I could not detect tin in UHAST T=0 unit, and the tin diffusion was found only in copper trace of C4 cage. Two question: 1) Could you tell me which pr

How difficult is it to switch from a no-clean solder paste to a water soluble solder paste between builds on SMT line?

Electronics Forum | Fri Mar 31 15:58:07 EDT 2017 | jutikagokarn

Thank you for your response. We build boards on an SMT line that is shared with other companies too and are currently using water soluble flux based solder paste on both boards. We realized an issue with washing on one of the boards so requested to

Questions About Risk of PCB Delamination as a Result of Moisture Build Up After Damage to Solder Mask

Electronics Forum | Tue Apr 23 17:18:54 EDT 2019 | laserpro

Hi Dave, Thanks a lot for your reply. After doing some process work on a Laser Etching machine it was brought to my attention by a colleague that if the solder mask was being penetrated fully, we could be at risk for absorption of moisture leading

200 pin connector reflow

Electronics Forum | Fri Nov 08 14:19:59 EST 2019 | dwl

You can try putting titanium stiffeners on the PCB to prevent it from warping. How thick is your stencil? More paste would give you a wider window however too much and you risk bridging. You could try over printing the pad at the heel and toe to get


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