root and cause and solder and splash - SMT Electronics Manufacturing

Electronics Forum: root and cause and solder and splash (Page 2 of 2)

Humidity and BGA Solder Sphere Sticking or Clumping

Electronics Forum | Tue Oct 07 10:23:35 EDT 2014 | reballer

I have been applying solder spheres to BGA packages. During the process, the spheres are run over a stencil for placement. The spheres tend to stick to each other (and clump), even away from the stencil pattern, when it is humid in the work area. I'm

High Relative Humidity and Blistering Issues in Assembly

Electronics Forum | Mon Sep 08 21:12:29 EDT 2014 | eurekadrytech

Hello, Manufacturing process with high moisture and humidity environments and long term storage will definitely see pop corning effects once high temperature from soldering and/or re-flow process. The moisture that has been adsorbed is likely the ro

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14 root and cause and solder and splash results

Electronics Forum: root and cause and solder and splash (Page 2 of 2)

Humidity and BGA Solder Sphere Sticking or Clumping

High Relative Humidity and Blistering Issues in Assembly

root and cause and solder and splash searches for Companies, Equipment, Machines, Suppliers & Information