Industry News | 2003-03-04 08:08:23.0
In a move that broadens its interconnect design services, Micromark C and CD has introduced a new development kit for the Flexstrip jumpers flexible interconnect system.
Industry News | 2003-02-19 09:34:32.0
Joined Forces to Continue Support of the Interconnect Market
Industry News | 2016-11-14 20:04:34.0
MIRTEC, “The Global Leader in Inspection Technology,” is pleased to announce that SMT Hautes Technologies, has selected MIRTEC’s award winning MV-7 OMNI as their future 3D AOI platform of choice.
Industry News | 2023-10-30 18:40:38.0
MIRTEC today announced that it is the recipient of the 2023 Mexico Technology Award in the Conformal Coating Inspection category for its revolutionary GENESYS-CC AI Based Conformal Coating AOI Series. The award was announced during a ceremony held on Wednesday, October 25, 2023 during the SMTA Guadalajara event in Mexico.
Industry News | 2011-05-10 20:22:36.0
MIRTEC, "The Global Leader in Inspection Technology," announces that the company was awarded a 150 machine purchase order with a leading mobile solution manufacturer at SMT/PCB NEPCON Korea.
Industry News | 2020-05-18 13:26:01.0
MIRTEC is pleased to announce that Integrated Test Corporation, a leading fabricator of ATE probe and final test PCBs, has selected MIRTEC as their 3D AOI partner with the purchase of an MV-7U OMNI Large Format PCB 3D AOI Machine.
Industry News | 2003-05-19 09:16:12.0
Labtech will be exhibiting at the 2003 IEEE MTT-S Exhibition
Industry News | 2003-03-21 08:12:24.0
Tecan reckons it is consistently producing what may be regarded as the most efficient stencils in the world today.
Industry News | 2016-11-01 19:52:12.0
MIRTEC, “The Global Leader in Inspection Technology,” announces that CALTRONICS Design & Assembly, Inc., a PCB Manufacturing and Electronic Design Company, purchased an award-winning MV-6 OMNI 3D AOI Machine during SMTA International in Rosemont, IL.
Industry News | 2003-06-12 08:24:37.0
An adaptive tool prevents small and/or light components "lifting" or "floating" on printed circuit board assemblies during the wave solder process.
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